Robert Boschgmbh

Thomas Schrimpf

Matthias Ludwig

Michael Hortig

Martin Rojahn

Wolfgang Woernle

Andreas Blum

Eberhard Haiss

Matthias Taglieber

The invention relates to a control unit (to), particularly for vehicle navigation, having a housing () that consists of at least two housing elements (), having at least one circuit carrier () on which at least one heat-generating component () is arranged, having a thermal transfer element (), made of metal, for dissipating the heat generated by the at least one heat-generating component (), having at least one sensor element () that is connected at least indirectly to the at least one circuit carrier (), having at least one plug connection body (), made of plastic, having connection elements () for making electrical contact with the at least one circuit carrier (), wherein the plug connection body () is formed in the region of a frame-like or cover-like housing element (), made of plastic, so as to be integral therewith or as a component that is separate from the housing element ().

Control unit

A method for producing a sensor module, in which a line part is provided in a first production step, which includes at least one receiving region for the force-fitting and/or form-fitting accommodation of a sensor element, and in a second production step for producing a housing, the line part is extrusion-coated with a plastic material in such a way that the at least one receiving region remains generally free of plastic material, and the sensor element is fixed in place in force-fitting and/or form-fitting manner in the at least one receiving region in a third production step.

Sensor module and method for producing a sensor module

An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.

Electronic component having a molded component housing

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Reutlingen, Germany

Thomas Schrimpf