Texas Instruments Corporation

Thomas S Spinelli

William G Manns

Donald F Weirauch

Harold M Yevak, Jr

Peter A Foley

Debra J Provazza

Edward J Deras

James A Coffee

A connector for mounting and electrically connecting a chip carrier unit in an electrical circuit has a plurality of electrical contacts secured in openings in the bottom of an electrically insulating body to permit cantilever spring deflection of the contacts in accommodating a chip carrier unit within the connector between the contacts. The contacts comprise wire members of round cross section each having an opposite end bent to be slidable along a narrow line of engagement with an inclined ramp surface on an adjacent side wall of the connector body. Each contact has a bowed portion intermediate the contact ends which is bowed away from the adjacent ramp surface to slidably engage terminals on the chip carrier unit as the unit is inserted into the connector. Engagement with the chip carrier terminals permits selected flattening of the bowed portions of the contacts and sliding of the opposite contact ends on the adjacent side wall ramp surfaces to provide simple beam spring deflection of the contacts in combination with the cantilever spring deflection, thereby to provide a force for resiliently engaging the chip carrier terminals.

Connector for a chip carrier unit

A package for shipping and dispensing articles such as integrated circuit mounting sockets or the like comprises an extruded, open-ended plastic tube having a reentrant rib formed along one tube side so that the interior tube chamber accommodates the bifurcated lateral outlines of such i.c. sockets in side-by-side serial relation to each other inside the tube with the socket bodies resting on the rib and with the socket terminals suspended and protected on either side of the rib. Segments of the tube material extending around part of the tube periphery near each end of the tube are separated from the tube material along the two opposite sides of each segment and are integrally attached to the tube material at the two opposite ends of the segments, the segments having plastic materials in the end portions of the segments deformed beyond the elastic limit of the tube materials so that the segments are reliably positioned to extend across the tube chamber with one of the sides of each segment disposed to intercept socket bodies inside the chamber and with the widths of the segments oriented to be generally parallel to the tube axis for positively blocking dispensing of sockets from open ends of the tube, the segments each being adapted to be selectively moved out of the tube chamber with a tool for permitting reliable and free dispensing of sockets from an open tube end.

Shipping and dispensing package for a series of articles

An electronic circuit interconnection system provides high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.

Electronic circuit interconnection system

An electronic circuit interconnection system provides high density mounting on ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.

An electronic circuit interconnection system permitting high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like has economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.

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Attleboro, MA, United States of America

Thomas S Spinelli