Delphi Technologies, Inc.

Inteva Products, LLC

Thomas S Ellis

Scott David Brandenburg

Bruce Alan Myers

Srimannarayana Kakarala

Jeenhuei S Tsai

Sandip R Patel

Glen E Novak

Ralph Bankston

Ralph E Bankston

Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an inorganic filler having a platelet geometric structure. The platelet structure of the filler allows a desirable coefficient of thermal expansion to be achieved using a very low level of filler material. This low level of filler material facilitates lower viscosity during forming of the encapsulation and/or overmolding, thereby facilitating complete filling of a mold cavity and underfilling of space between a circuit board and a semi-conductor chip electrically connected to the circuit board. In addition, the low viscosity has processing advantages that reduce the potential for damage to electrical components during encapsulation, overmolding and/or underfilling.

Polymer encapsulated electrical devices

Thermoplastic polyolefin compositions and a process for preparing the same are provided comprising a blend of polypropylene, and styrenic elastomer. The compositions may further comprise ethylene copolymer elastomer, polymer additive, such as polymer surface modifier, powder flow additive, stabilizer and/or color pigment. The compositions are particularly applicable for use in a slush molding process where low melt viscosity is desired to form improved surface quality thermoplastic polyolefin skin. A process is disclosed for preparing thermoplastic polyolefin into a slush moldable powder by melt compounding the composition to form pellets, and further processing the pellets by cryogenic pulverization or by extruding micropellets in one step using a gear pump to increase the melt pressure.

Thermoplastic polyolefin compositions and methods of preparing thermoplastic polyolefin compositions for soft sheet applications

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Romeo, MI, United States of America

Thomas S Ellis