Infineon Technologies Ag

Qimonda Ag

Thomas Röhr

Georg Braun

Stefan Lammers

Heinz H&ouml;nigschmid

Zoltan Manyoki

Thomas B&ouml;hm

Holger Hübner

Heinz Honigschmid

Thomas Böhm

The micro electronic device comprises a substrate with a surface and a plurality of storage elements in serial connection formed at the surface of the substrate, a plurality of transistors, each transistor being connected parallel to one of the plurality of storage elements. Each storage element comprises a storing material between a first electrode and a second electrode. A storing material provides at least two different storing states with different electrical properties. The first electrode comprises a first material and the second electrode comprises a second material different from the first material. The plurality of storage elements is oriented parallel to the surface of the substrate.

Microelectronic device with a plurality of storage elements in serial connection and method of producing the same

A memory device including an array of resistive memory cells, which are arranged in columns and rows, and wherein each resistive memory cell each is connected to a word line, to a bit line, and to a reference electrode. The word lines are assigned to the rows and the bit lines are assigned to the columns. The resistive state of the resistive memory cells corresponds to a logical state thereof, and the memory device further comprises an evaluation device, which is coupled to the bit lines, for evaluating the resistive state of at least one of the resistive memory cells during a reading operation. The respective resistive memory cell is selected by addressing the word line to which the resistive memory cell is connected.

Memory device having an array of resistive memory cells

An integrated memory arrangement based on resistive memory cells that can be changed over between a first state of high electrical resistance and a second state of low electrical resistance, each memory cell having an electrical additional capacitance that increases its capacitance, and to a production method.

Integrated memory arrangement based on resistive memory cells and production method

A semiconductor memory device has a particularly space-saving configuration of the memory areas and, in particular, of the selection devices assigned to the memory areas. During operation, each selection device can be assigned in a controllable manner to a plurality of memory areas such that selectively each of the selection devices can carry out an addressing and selection in one of the assigned memory areas.

Semiconductor memory device having a plurality of memory areas with memory elements

A semiconductor component having a material-reinforced contact area formed of a metal layer is disclosed. The contact area is jointly formed by a second metal area of a first metal layer and a fourth metal area of a second metal layer which is to be contacted. A thickness of the contact area material is at least twice that of a single metal layer and thereby prevents penetrative etching when a hole is created for contacting the metal layer.

Semiconductor component having a material reinforced contact area

An integrated memory has a multiplexer and a differential sense amplifier with a differential input. The differential sense amplifier is connected to three bit lines by the multiplexer. The multiplexer electrically connects the differential input of the sense amplifier to any two of the three bit lines connected to it respectively, in accordance with its activation.

Integrated memory and corresponding operating method

The invention relates to a memory configuration comprising a multiplicity of memory cells. Each of the memory cells has at least one ferroelectric storage capacitor and a selection transistor. The memory cells are addressed via word lines and bit line pairs. It is possible for a reference signal obtained from a reference cell pair via a bit line pair to be compared with a read signal from a memory cell in a sense amplifier. The sense amplifier is thereby assigned two bit line pairs connected in such a way that the reference signal is applied via the first bit line pair and, at the same time, the read signal is applied via the second bit line pair to the sense amplifier.

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Aschheim, Germany

Thomas Röhr