Cisco Technology, Inc.

Macom Technology Solutions Holdings, Inc.

Thomas Robert Daugherty

Vipulkumar K Patel

Kishor V Desai

Mark Andrew Webster

Prakash B Gothoskar

Kalpendu Shastri

Soham Pathak

Bipin Dama

Ravinder Kachru

Rao Yelamarty

Kaushik Patel

Michael Everett Fangman

Hendrikus Johannes Jacobus Thoonen

Systems and methods are provided to align a first optical component carried by a first semiconductor chip with a second optical component carried by a second semiconductor chip. Each of the first semiconductor chip and the second semiconductor chip may include at least one primary semiconductor chip fiducial which assists in the alignment of the first optical component carried by a first semiconductor chip with a second optical component carried by a second semiconductor chip.

Optical component alignment system and method using plural fiducials

A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a 'platform' (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

Wafer scale packaging platform for transceivers

Growing community of inventors

Allentown, PA, United States of America

Thomas Robert Daugherty