Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.p.

Thomas Robert Bowden

John P Franz

Tahir Cader

Keith J Kuehn

Kevin D Conn

John Norton

Joseph R Allen

Melvin K Benedict

Binh Nguyen

Alan B Doerr

Allen B Doerr

Richard A Bargerhuff

Sammy L Zimmerman Sr

A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Thermal management assembly

A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

Top loading cartridge

Top loading fan cartridge

Growing community of inventors

Houston, TX, United States of America

Thomas Robert Bowden