Continental Automotive Gmbh

Vitesco Technologies Gmbh

Zf Friedrichshafen Ag

Walter Sohner Gmbh & Co. Kg

Tyco Electronics Pretema Gmbh & Co. Kg

Cpt Group Gmbh

Thomas Riepl

Detlev Bagung

Gregory Drew

Michael Decker

Christina Quest-Matt

Robert Ingenbleek

Daniela Wolf

Bernd Roller

Holger Schlotter

Alan Kang

Marius Tarnovetchi

Karl Smirra

Hubert Remmlinger

Günter Lugert

Michael Schwab

Stefan Peck

Andreas Rekofsky

Hermann Haemmerl

Lorenz Berchtold

Jan Keller

Dietmar Kurzeja

Oskar Schütz

Guenter Lugert

Thomas Bäumler

Christian Braun

Manfred Binder

Hermann Hämmerl

A first and second substrate, and electrically conductive first and second connection parts are provided in a method for establishing an electrically conductive connection between two substrates. The first connection part is mounted on the first substrate by a first releasable connection and the second connection part is respectively mounted on the second substrate by a releasable connection. An electrically conductive connection assembly containing the first connection part and the second connection part is established by either a cohesive connection between a connection portion of the first connection part and a connection portion of the second connection part or an electrically conductive crossmember provided and a cohesive connection of a first length portion of the crossmember to the connection portion of the first connection part and a second cohesive connection of a second length portion of the crossmember to the connection portion of the second connection part being established.

Apparatus and method for establishing an electrically conductive connection between two substrates

A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.

Semiconductor component arrangement, method for fabrication thereof and heat dissipation device

A semiconductor assembly includes a semiconductor component having a redistribution substrate with a top side, an underside and a semiconductor chip on the top side. Contact connection pads for connection to contact pads of the chip are on the top side of the substrate. External contact pads on the underside are electrically connected to the contact connection pads by conductor tracks. The external contact pads are at a greater distance from one another in a first region than a second region of the underside. The semiconductor component is on a printed circuit board. Contact pads corresponding to the external contacts are on a top side of the printed circuit board and are at a greater distance from one another in a first region than a second region of the top side. Through holes are formed between the contact pads in the first region of the printed circuit board.

Semiconductor assembly

An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.

Electrical component and method for the production thereof

An electronic assembly, has at least one circuit board with conductor tracks, at least one current-limiting arrangement in the form of a thermal predetermined breaking point in at least one of the conductor tracks, and a fire-containment device in the region of the current-limiting arrangement.

Electronic unit having an assembly for limiting current

A method is specified for monitoring an electronic control unit for a motor vehicle. An electronic control unit with a monitoring circuit, which contains at least one sensor component, is provided. A measured value is recorded by means of the at least one sensor component, on the basis of which an actual value of a characteristic value representative for the thermal, mechanical and/or chemical loading of the control unit is determined and compared with a predetermined set-point value. A signal is emitted as a function of the result of the comparison. A device and a control unit are additionally specified.

Method for monitoring an electronic control unit and control unit for a motor vehicle

A housing for a control unit of a motor vehicle has a housing element and a further element attached to the housing element by way of a joining technique that does not include a joining layer or by way of a joining layer. The housing element has a main body composed of a light metal and a protective layer applied to the main body. The protective layer is arranged between the main body and the attached further element. The invention further relates to a method for producing a housing and to a control unit.

Housing for a control unit

A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.

Method for reinforcing conductor tracks of a circuit board

An electronic control unit having a sealed housing including a main body and a cover fixed to one another and a sealing element in contact with one and/or the other of the main body and the cover. The control unit also includes a circuit board arrangement in the housing which a circuit board is located. In addition, the control unit also includes at least one housing stabilizing element in contact with the circuit board arrangement and one or the other of the main body and the cover.

Electronic control unit with a housing stabilizing element and housing for electronic control unit

An arrangement for an electronic device is disclosed. A plurality of electrically conductive pins is positioned in respective vias of the circuit carrier, the pins extend from a first face of the circuit carrier to a contact end in order to electrically contact one or more components. The arrangement is equipped with an electrically insulating layer on a circuit carrier face, which is the first or a second face, in the region of the pin, the insulating layer having a prefabricated element which is positioned on the face of the circuit carrier. A portion of each pin, the portion being arranged adjacently to the respective via on the face, is surrounded by the material of the insulating layer in a continuously lateral manner.

Arrangement with circuit carrier for an electronic device

A control unit has a substrate with an electrically conductive structure, an integrated circuit device, which is installed on the substrate in an electrically conductive manner, and a sacrificial structure on the substrate. The sacrificial structure is configured to be irreversibly destroyed if the integrated circuit device is removed from the substrate. The electrically conductive structure has at least one conducting track applied to the substrate. The sacrificial structure is formed by a segment of the conducting track. An electrically insulating connecting layer that connects the integrated circuit device, the substrate, and the segment of the conducting track is formed. The sacrificial structure can be destroyed by the connecting layer when the integrated circuit device is removed.

Control unit having a sacrificial structure

A method for producing a lateral connection of an electro-optical interface is specified. In the method, a printed circuit board having a non-curved center plane is provided. An electro-optical component and an electrical component are arranged and oriented with respect to one another in a connection region. A first section of the printed circuit board is deformed in such a way that the center plane encloses an angle with the non-deformed layer in the region of the first section. An electro-optical interface and a control device are also specified.

Method for producing an electro-optical interface, electro-optical interface, and control unit

An electric component has a housing part and a component support which is provided with a conductor path structure. The conductor path structure has an interruption, by which a connection section of the conductor path structure is galvanically separated from a main section of the conductor path structure. The component support is arranged on the housing part such that a heat-conductive connection is produced between the component support and the housing part. The main section remains galvanically separated from the housing part. The electric resistance between the main section of the conductor path structure and the housing part is measured. The component support is secured to the housing part by a securing element. The interruption is electrically bridged by the securing element and the main section is electrically conductively connected to the housing component.

Electric component and method for producing same

A housing for an electronic control unit is disclosed. The housing contains a main body having a base and a wall rising from the base, a cover supported on the wall opposite to the base and fixed to the housing for defining an inner volume, and a seat on the wall for a sealant interposed between the main body and the cover contributing to isolate the inner volume from an outer volume. The seat contains a portion adjoining the inner volume or the outer volume, the portion having an edge on the wall inclined with respect to the cover.

Housing for electronic control unit

A plug contact is provided for the provision of a press contact with a mating contact. The plug contact is composed of an electrically conductive material. The plug contact has a first contact section for the provision of the press contact. The first contact section has, at least in places, an electrically conductive organic coating, and the organic coating contains a metal, an alloy, and/or an electrically conductive polymer. A printed circuit board arrangement is also provided.

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Bad Abbach, Germany

Thomas Riepl