Pulse Electronics Gmbh

Pulse Engineering, Inc.

Thomas Rascon

Aurelio J Gutierrez

Mohammad Saboori

Thuyen Dinh

Christopher P Schaffer

Timothy J Morrison

Gary L Hurd

Collin Kneifl

Farid Hamidy

Inductive apparatus

Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

Methods of making and using inductive devices with splits

Inductive devices with splits and methods of making and using the same

An integrated connector module (ICM) is disclosed. In one embodiment, the ICM includes a plurality of shielding components, the plurality of shielding components comprising a port to port shield, an insert to insert shield and a main body shield. The ICM also contains one or more housing components, the one or more housing components comprising a plurality of ports that are arranged so as to be offset from a main signal conditioning portion of the one or more housing components; and an electronics assembly disposed within the one or more housing components. Methods and apparatus for utilizing and manufacturing the aforementioned ICM are also disclosed.

Integrated connector apparatus for PCIe applications

High electrical isolation connector apparatus and methods. In one embodiment, an integrated connector module (ICM) is disclosed. The ICM includes a number of adjacent electronic subassemblies that are shielded through the use of an insert body shield. The insert body shield beneficially increases electrical isolation between adjacent subassemblies thereby further mitigating possible electrical noise. The insert body shield is configured to be received within a slot formed within the connector housing. An internal shield is also included that is received in a slot of an insert body of the electronic sub-assemblies, thereby effectively shielding adjacent component receiving cavities from one another. Methods and apparatus are also disclosed which make use and take advantage of these shielded ICMs. For example, telecommunications/networking equipment that incorporates these ICMs are also disclosed.

Shielded integrated connector modules and assemblies and methods of manufacturing the same

An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a multi-port modular jack, and incorporates a PSE controller board disposed in the rear portion of the connector assembly, e.g., outside the connector housing. The PSE controller board controls the power to a powered device and may be adapted to, for example, distinguish whether the device is a short circuit or a network interface card, guarantee the supply of power to selected ports, and prevent cables from transmitting abnormal power. Heat removal features are also optionally utilized to effectively dissipate heat produced by the electronic or signal conditioning components utilized on said multi-port modular jack. In some embodiments, the PSE controller board is also optionally made removable from the jack housing.

Power-enabled connector assembly and method of manufacturing

A connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a multi-port modular jack, and incorporates a PSE controller board disposed in the rear portion of the connector assembly, e.g., outside the connector housing. The PSE controller board controls the power to a powered device and may be adapted to, for example, distinguish whether the device is a short circuit or a network interface card, guarantee the supply of power to selected ports, and prevent cables from transmitting abnormal power. Heat removal features are also optionally utilized to dissipate heat produced by the electronic or signal conditioning components utilized on said multi-port modular jack. In some embodiments, the PSE controller board is also optionally made removable from the jack housing.

Connector apparatus and methods providing for 'keep-out' functionality against improperly sized plugs or inserts are disclosed. In one embodiment the invention discloses a connector assembly incorporating an integrated keep-out feature associated with the housing. In one variant, the connector assembly comprises a modular jack connector, and the keep-out feature(s) is/are formed substantially within one or more the sidewall(s) of the housing, thereby simplifying its assembly and reducing its cost, as well as conserving on connector interior space. In another embodiment, the keep-out feature comprises an element disposed substantially within a plane parallel to the front face of the connector. Methods for manufacturing and using connectors with integrated keep-out features are also disclosed.

Connector keep-out apparatus and methods

A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

Growing community of inventors

Temecula, CA, United States of America

Thomas Rascon