Infineon Technologies Ag

Thomas R&ouml;hr

Heinz H&ouml;nigschmid

Thomas B&ouml;hm

Georg Braun

Zoltan Manyoki

Ernst Neuhold

Dietmar Gogl

Christine Dehm

Helmut Kandolf

Robert Esterl

Kurt Hoffmann

Oskar Kowarik

Carlos Mazure-Espejo

Michael Jacob

Gerhard M&uuml;ller

A memory matrix has at least one cell array including column lines and row lines. Memory elements are situated at points where the row lines and column lines intersect one another. In each case two adjacent lines are guided such that they cross one another in such a way that the two lines change their spatial configurations in sections along the direction in which they run. Thus an overcoupling of signals between the lines is minimized.

Random access semiconductor memory with reduced signal overcoupling

The invention relates to an MRAM configuration that includes a selection transistor connected to several MTJ memory cells. The selection transistor has an increased channel width.

MRAM configuration having selection transistors with a large channel width

A test circuit is integrated in a ferroelectric memory component in order to make analog measurements of bit line signals of ferroelectric memory cells. The test circuit, when in a test mode, reads out analog signal values for the respective memory content of the cells and feds the analog signal values to a downstream evaluation device. The test circuit is integrated as an analog circuit in the ferroelectric memory component and, in the test mode with non-activated or disconnected sense amplifiers, is configured to output analog bit line signals from the memory component to a point outside the memory component.

Test circuit for an analog measurement of bit line signals of ferroelectric memory cells

An integrated ferroelectric memory configuration and a method for producing the integrated ferroelectric memory configuration, in which memory cells are arranged using the stacking principle, and both capacitor electrodes, which are located one above the other, of each memory cell are directly electrically connected by means of contact plugs to corresponding source and drain regions of an associated selection transistor in the substrate. Contact plugs for the contact connection to the upper capacitor electrodes are produced from above the configuration.

Ferroelectric memory configuration and a method for producing the configuration

In order to provide a particularly space-saving capacitor configuration in a memory device, a plurality of second electrode regions which are not in direct electrical contact with one another are formed on areas of a first electrode region covered by a dielectric material. During operation of the capacitor configuration, portions of the first electrode region form bottom electrodes which are connected by a connecting region, so that an additional connecting device for the bottom electrodes is not necessary.

Process for producing a capacitor configuration

The invention relates to a method for operating a ferroelectric memory configuration in the V /2 mode. The memory configuration has a large number of memory cells which each have at least one selection transistor, one storage capacitor with an upper and a lower electrode and one short-circuiting transistor whose source-drain junction is connected in parallel with the storage capacitor. After a read or write procedure in which the memory cells are driven via respectively associated word lines and via respectively associated bit lines which are precharged in a precharge phase, the short-circuiting transistor is driven during a standby phase and in the process short-circuits the electrodes in the storage capacitor. The method is characterized in that the time of the standby phase coincides with the time of the precharge phase and, in the process, the bit lines are at a different potential with respect to that of the two electrodes of the storage capacitor.

Method for operating a ferroelectric memory configuration and a ferroelectric memory configuration

An integrated memory contains two normal read amplifiers and two first redundant read amplifiers. It also contains bit lines which are combined into at least two individually addressable normal columns, at least one of which from each normal column is connected to one of the normal read amplifiers. It also has first redundant bit lines which are combined into one individually addressable redundant column, at least one of which is connected to one of the redundant read amplifiers. The first redundant read amplifier and its redundant columns are provided for replacing the two normal read amplifiers and one of the normal columns.

Integrated memory with redundancy

An integrated semiconductor memory has memory cells with a ferroelectric memory property. The memory cells are in each case connected between a column line and a charge line. The column line is connected to a read amplifier which supplies an output signal. The charge line is connected to a driver circuit which provides the charge line with a given potential. In an inactive mode, the column line and the charge line are jointly connected to a connection for a common supply potential in the read amplifier or in the driver circuit. As a result, a relatively quick equalization of a potential between the lines is possible. Thus, unintended changes in the memory cell content due to interfering voltages are avoided.

Integrated semiconductor memory having memory cells with a ferroelectric memory property

The memory has identically constructed memory cells and reference cells. An item of reference information is written into the reference cells by uncoupling the reference cells from the read amplifiers via first switching elements, and by electrically connecting the part of the bit lines that is connected to the reference cells via second switching elements to a potential line carrying the reference information.

Integrated memory having memory cells and reference cells, and operating method for such a memory

A current driver configuration for MRAMs includes word-line drivers and bit-line drivers at respective first ends of word lines and bit lines. The word line drivers and the bit line drivers each include a series circuit formed by an n-channel field-effect transistor and a current source. Further series circuits are provided at the respective second ends of the word lines and the bit lines. Each of the further series circuits includes a second n-channel field-effect transistor and a voltage source.

Current driver configuration for MRAM

A decoder element is provided with an output, whereby an output signal with one of three different possible potentials is produced. The output signal may have a value of either a first potential, a second potential, and a third potential, where the second potential lies between the first potential and the third potential. The output signal is produced according to voltage values of input signals at terminal connections of the decoder element.

Decoder element for generating an output signal having three different potentials and an operating method for the decoder element

Disclosed is a method for producing semiconductor elements including a metal layer ( ) configured on a semiconductor substrate ( ). The inventive method consists of the following steps: a silicon layer ( ) is deposited on a metal layer ( ); an etch mask is applied in order to structure the silicon layer (1%); the silicon layer is selectively etched ( ) using the etch mask ( ); and the metal layer ( ) is structured in an etching process using a selectively etched silicon layer ( ) as a hard mask.

Method of fabricating semiconductor components

An integrated memory has two first switching elements, which respectively connect a bit line of a first bit line pair to a bit line of a second bit line pair. In addition, the integrated memory has two second switching elements, which respectively connect one of the reference cells of one bit line pair to that bit line of the other bit line pair which is not connected via the corresponding first switching element to the bit line assigned to this reference cell. Information is written back to the reference cells via the sense amplifiers. A method of operating the integrated memory is also provided.

Integrated memory having memory cells and reference cells, and corresponding operating method

In a semiconductor memory configuration, a refresh operation is always started by a refresh logic circuit when a comparison circuit determines that there is a specific minimum difference when comparing a characteristic variable of at least one reference memory cell with a reference value (VREF).

Semiconductor memory configuration with a refresh logic circuit, and method of refreshing a memory content of the semiconductor memory configuration

A description is given of a method for operating an integrated memory which has memory cells each having a selection transistor and a storage capacitor with a ferroelectric storage effect. The memory contains a plate line, which is connected to one of the column lines via a series circuit containing a selection transistor and a storage capacitor of respective memory cells. A memory access is carried out according to the &ldquo;pulsed plate concept&rdquo;. In this case, the temporal sequence is controlled in such a way that, in an access cycle, the storage capacitor of the memory cell to be selected is in each case charged and discharged by the same amount. An attenuation or destruction of the information stored in the memory cells, which is caused by source-drain leakage currents of unactivated selection transistors, is thus avoided.

Growing community of inventors

Yokohama, Japan

Thomas Röhr

Growing community of inventors

Yokohama, Japan

Thomas R&ouml;hr

Thomas Röhr