Infineon Technologies Ag

Thomas Rainer Herzog

Robert Aigner

Stephan Marksteiner

Lueder Elbrecht

Winfried Nessler

Rainer Tilgner

Peter Alpern

Heinz Schauer

Wolfgang Sauert

A semiconductor component is provided having a layer sequence for conversion of acoustic to thermal signals and electrical voltage changes to one another, as well as a process for its production. The layer sequence has a lower electrode, an upper electrode and a layer which is arranged between them and is piezoelectrical or pyroelectrical. An auxiliary layer is arranged between the lower electrode and the layer and is used for homogeneously oriented growth of the layer during the production process. The auxiliary layer preferably consists essentially of amorphous silicon, amorphous silicon oxide or amorphous silicon nitride.

Semiconductor element comprising a sequence of layers for converting acoustic or thermal signal and electrical voltage changes into each other and method for producing the same

An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.

Electronic component having a semiconductor chip

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Hoehenkirchen-Siegertsbrunn, Germany

Thomas Rainer Herzog