Motorola Corporation

Thomas R Yarbrough

James H Carlquist

Kenneth J Long

Edward C Dasse

Walid S Ballouli

Charles F Toewe

Robert W Bollish

Kelvin L Holub

Alfredo Figueroa

Marcus R Burton

Shih K Cheng

Larry M Beasley

Wafer level testing of a wafer (500) is accomplished by dividing the integrated circuits of the wafer into a plurality of segmented bus regions (514, 516, and 518 for example). Each bus region is formed having its own set of test conductors (520-530) wherein each set of test conductors are isolated from all other sets of test conductors on the wafer. Each test conductor has at least one contact pad (531-546) where each contact pad lies within a periphery of the integrated circuits' active areas. By forming pads over ICs and by sub-dividing the bus structure of test conductive lines, more high powered ICs can be tested in a wafer-level manner with fewer problems associated with speed, power, throughput, and routing problems.

Apparatus for performing wafer-level testing of integrated circuits

A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).

Apparatus for performing wafer level testing of integrated circuit dice

Method and apparatus for performing wafer level testing of integrated

An integrated circuit test site assembly for testing pin grid array (PGA) packaged integrated circuits having removable contact pins. The removable contact pins, which are preferably spring-loaded pogo pins, enable the test site assembly to be repaired quickly and easily with a minimum of down time. In addition, the test site need only be loaded with the number of pins required to make contact with the PGA lead pattern.

Integrated circuit test site

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Buda, TX, United States of America

Thomas R Yarbrough