Apple Inc.

Thomas R Louchard

Ashutosh Yugesh Shukla

Vincent Yan

Systems and methods for improved window mounting on electronic devices are provided. A window mounting assembly can include a heat activated adhesive, such as a heat activated film ('HAF'), which can be used to secure a window to an enclosure. In some embodiments, heated air can be blown in from a bottom side of the window, which can provide better offset control in the assembly. In some embodiments, an undercut can be made in the enclosure that can act as a trap for HAF overflow. An overhang that is created by the undercut can reduce the visibility of HAF overflow from a user. In addition, the heated air that is applied to the window can create a high pressure region in an area underneath the window. The high pressure region can direct the HAF overflow away from this area and towards the undercut in the enclosure.

Growing community of inventors

Pacifica, CA, United States of America

Thomas R Louchard