Indium Corporation

Thomas R Gross

Robert N Jarrett

Craig K Merritt

Anthony D Lanza, Jr

Some implementations are directed to a burn-in solder preform including: a barrier layer to prevent thermally conductive material from adhering to a semiconductor component during burn-in testing; and a thermally conductive cladding layer attached to a portion of the barrier layer such that at least one dimension of the barrier layer extends past the thermally conductive cladding layer, where the thermally conductive cladding layer is attached over the barrier layer through continuous attachment or spot attachment. In some implementations, a method includes: placing the aforementioned burn-in solder preform between a test fixture and a semiconductor component; attaching a portion of the barrier layer of the burn-in solder preform to a head of the text fixture; and after attaching a portion of the barrier layer of the burn-in solder preform to the head of the test fixture, performing burn-in testing of the semiconductor component.

Growing community of inventors

Utica, NY, United States of America

Thomas R Gross