Osram Gmbh

Continental Automotive Gmbh

Osram Ag

Zf Friedrichshafen Ag

Ledvance Gmbh

Osram S.p.a. - Societa' Riunite Osram Edison Clerici

Thomas Preuschl

Peter Sachsenweger

Josef Loibl

Alessandro Scordino

Guenter Hoetzl

Robert Kraus

Karl Smirra

Nicole Breidenassel

Tobias Frost

Steffen Strauss

Hermann-Josef Robin

Florian Zeus

Klaus Eckert

Markus Hofmann

Harald Dellian

Alessandro Bizzotto

Lorenzo Roberto Trevisanello

Steven Wetzel

Dieter Eisenhut

Birgit Wels

Huey Ling Lim

Hoetzl Guenter

Christoph Strauss

The present disclosure relates to an electronic transmission controller, with a housing, a printed circuit board assembly, and at least one electronic module mounted on the printed circuit board assembly. The printed circuit board assembly may include a first region extending inside the housing, the first region being sealed from an external fluid. The printed circuit board assembly may include a second region extending outside the housing. The printed circuit board assembly may include a plurality of electrically conductive conductor path layers which are electrically insulated against one another by dielectric layers. An outer layer made of a fluid resistant and electrically insulating material may be applied to at least one outer electrically conductive conductor path layer of the plurality of conductive path layers at a location of the second region of the printed circuit board assembly.

Electronic transmission controller, and method for producing same

Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.

Optoelectronic assembly and method for producing an optoelectronic assembly

An optoelectronic assembly may include a substrate, which has a first contact region at a first side thereof, an optoelectronic component arranged on the first side of the substrate, which has a first contact coupled to the first contact region, a printed circuit board with conductor tracks, which is coupled to the first side of the substrate at a first side of the printed circuit board and which has a central cutout, in which the optoelectronic component is exposed, and which has a first contact cutout, which overlaps the first contact region, at least one electronic component arranged on a second side of the printed circuit board, which is coupled to the conductor tracks, and a connection element, which is arranged in the first contact cutout and electrically couples the first contact region to the conductor tracks, wherein the connection element fixes the substrate to the printed circuit board.

Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.

Lighting module

Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and at least one electronic component, which is integrated in the covering element and is electrically connected to the first printed circuit board.

A fastening element for fastening a light source substrate to a support. The fastening element is configured to be seated on the light source substrate, and includes at least one fastening portion for fastening to the support.

Fastening element, luminous module and luminous apparatus

A method for producing a striplight is disclosed. Said method utilizing at least the following steps: (a) providing a strip-shaped carrier, which is populated on at least one side with a plurality of semiconductor light sources; (b) arranging at least one electrical line on the carrier; and (c) casting the at least one electrical line on the carrier. A striplight which has: a strip-shaped carrier, populated on at least one side with a plurality of semiconductor light sources; at least one electrical line, which is arranged on the carrier; and joint casting of the carrier and the at least one electrical line, is likewise disclosed.

Method for producing a striplight and striplight

A light emitting diode lamp may include a socket; a first circuit board; and at least one plug connector electrically connected to the socket; wherein the connector is connected to the circuit board by means of a plug section.

LED lamp

An illumination device may include at least one light source; and at least two printed circuit boards arranged at least partially one above the other; wherein the at least two circuit boards are connected by means of at least one plug-connection element, with the plug-connection element being embodied on at least one side as a press-fit plug.

Illumination device comprising two printed circuit boards

A semiconductor light-emitting device is disclosed. The device includes a plurality of semiconductor light sources and a driver with no galvanic isolation for operating the semiconductor light sources wherein the semiconductor light sources may be divided into at least two carriers, the carriers are applied on an electrically conductive substrate, and the driver, and current-conducting regions also provided on a surface of the carriers, are electrically insulated from the substrate.

Semiconductor light device having a galvanic non-insulated driver

A lighting module may include a housing having an open rear side, a light source substrate with at least one light source arranged thereon, a driver circuit board accommodated in the housing, at least one electrical connection element for electrically connecting the driver circuit board to the light source substrate, and a closure element for closing the open rear side, wherein the closure element is designed for feeding through at least one electrical connection.

A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.

Module for integrated control electronics having simplified design

In various embodiments, a lighting system may comprise at least one connection element and at least one luminous band having at least one band-shaped unit circuit board, whereby the unit circuit board is equipped with at least two semiconductor light sources, and has at least one contact area arranged between at least two semiconductor light sources, whereby the contact area is configured so it can be severed and the contact area and the connection element are configured such that after severing of the contact area the connection element can be applied onto the contact area and at least one circuit can be closed on the unit circuit board by applying the connection element onto the contact area.

Lighting system comprising at least one luminous band

A multilayered LED printed circuit board with electrically insulating layers includes at least one electrically insulating material and electrically conductive layers consisting of an electrically conductive material, wherein at least one of the electrically conductive layers is structured with a conductor track structure, wherein the at least one structured electrically conductive layer is arranged on an upper side of the LED printed circuit board, and wherein a plurality of LEDs is arranged on the at least one structured electrically conductive layer on the upper side. The LED printed circuit board further includes: a thermally conducting element, and thermal paths comprising an electrically conductive material, which are arranged, in each case in contact-making fashion, between the LEDs and the thermally conducting element.

Multilayered LED printed circuit board

In various embodiments, a light emitting diode module is provided. The light emitting diode module may include at least one light emitting diode; wherein the at least one light emitting diode is connected in parallel with at least one first capacitor; wherein the at least one light emitting diode is arranged in a first structural unit, and the at least one first capacitor is arranged in a second structural unit, wherein the first structural unit and the second structural unit are electrically coupled to one another via a first cable.

Growing community of inventors

Sinzing, Germany

Thomas Preuschl