Atotech Deutschland Gmbh

Thomas Pliet

Bernd Roelfs

Bert Reents

Soungsoo Kim

Markus Youkhanis

Toshiya Fujiwara

Rene Wenzel

Heiko Brunner

Dirk Rohde

Sven Lamprecht

Kai-Jens Matejat

Ingo Ewert

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper.

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.

Aqueous, acid bath and method for the electrolytic deposition of copper

Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one contact area, ii) form a solder mask layer that is placed on the substrate surface and patterned to expose the at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the conductive layer and v) etch away an amount of the solder deposit layer containing tin or tin alloy sufficient to remove the solder deposit layer from the solder mask layer area leaving a solder material layer on the at least one contact area.

Method to form solder deposits on substrates

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Berlin, Germany

Thomas Pliet