Ev Group E. Thallner Gmbh

Thomas Plach

Thomas Wagenleitner

Florian Kurz

Jurgen Markus Suss

Markus Wimplinger

Friedrich Paul Lindner

Kurt Hingerl

Dominik Zinner

Jurgen Mallinger

Christoph Flötgen

Christoph Flotgen

Boris Povazay

Thomas Glinsner

Thomas Wieser

Florian Schmid

Roman Anzengruber

Alexander Nones

Jurgen Michael Suss

Uwe Kriebisch

Peter Starzengruber

Harald Rohringer

Jürgen Mallinger

Jürgen Markus Süss

Johann Bernauer

Jürgen Markus SÜSS

Paul Lindner

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.

Apparatus and method for bonding substrates

The invention relates to a device and a method for the alignment of substrates.

Device and method for the alignment of substrates

A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.

Device and method for bonding of substrates

A measuring device for determining a course of a bonding wave in a gap between a first substrate and a second substrate, and a method for determining a course of a bonding wave in a gap between a first substrate and a second substrate.

Measuring device and method for determining the course of a bonding wave

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Device and method for bonding substrates

A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force Fand holding the second substrate to a second sample holder surface of a second sample holder with a holding force F; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature T; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature Tis reduced at the second sample holder surface during the bonding.

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.

Method for bonding substrates

A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.

Substrate holder and method for bonding two substrates

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Linz, Austria

Thomas Plach