Texas Instruments Corporation

Tyco Electronics Corporation

The Whitaker Corporation

Thomas Philip Budka

Nitin Jain

Angelos Alexanian

Cary Kyhl

A method for making a bond-wire interconnect to pass signals between different substrates is described. According to this process, a first compensated bond wire interconnect is made to connect two substrates of a first type at an operating frequency, the first interconnect comprising a bond-wire of a fixed length and a first pair of compensation structures formed from a lowpass filter prototype. A second compensated bond wire interconnect is made to connect two substrates of a second type at the operating frequency, the second interconnect having a bond-wire of the fixed length and a second pair of compensation structures formed from the lowpass filter prototype. A bond-wire of the fixed length, one compensation structure from the first pair, and one compensation structure from the second pair, are combined to make a third compensated bond wire interconnect to connect a substrate of the first type with a substrate of the second type at the operating frequency.

Interchangeable bond-wire interconnects

A transition from a planar transmission line to a waveguide has a planar transmission line patterned onto a glass substrate. A mode transformer on the substrate is electrically connected to a transmission line and converts a transverse electric or quasi-transverse electric mode signal carried by the transmission line to a waveguide mode signal. A combination of a first extension of the substrate and a dielectric portion having some depth makes up a first impedance matching element . A second impedance matching element is a combination of a second extension of the substrate and a dielectric portion having another depth greater than the first depth. The aperture created by the second impedance matching element launches an RF signal into the air for use as a wireless communication signal. Also disclosed is a method for optimizing a transition according to the teachings of the present invention for alternative dimensions and dielectrics.

Planar transmission line to waveguide transition for a microwave signal

An ultrawide bandwidth z-axis interconnect which has a z-axis lap joint structure with embedded ground planes that self compensate for the interface misalignment and impedance mismatch. The structure acts as a low pass filter that can be tailored to meet performance requirements from DC to in excess of 100 GHz. The area required for the interface is reduced while increasing the alignment tolerance range. The interconnect structure is easily modeled as a multi-element low pass filter with interfacing transmission lines (microstrip or stripline) to allow for rapid design efforts and reduction in cycle time for a program.

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Shirley, MA, United States of America

Thomas Philip Budka