Xilinx, Inc.

Thomas Paul Leboeuf

James F Anderson

Jason J Moore

James D Wesselkamper

An integrated circuit die stack and method thereof are described herein that is capable of detecting a physical tampering event. The integrated circuit die stack includes a first integrated circuit die including a sensor network that extends substantially across an entire top surface of the first integrated circuit die, and a second integrated circuit die stacked below the first integrated circuit die. The second integrated circuit die is configured to receive sensing signals generated by the sensor network via a plurality of through-silicon-vias coupled with the first integrated circuit die and the second integrated circuit die.

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Sandia Park, NM, United States of America

Thomas Paul Leboeuf