Dow Global Technolgoies LLC

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Nitta Haas Inc.

Thomas P Willumstad

David R Wilson

Mark F Sonnenschein

Sukrit Mukhopadhyay

Arjun Raghuraman

Heather Spinney

Kshitish A Patankar

Jody J Henning

Bainian Qian

George C Jacob

Marty W DeGroot

William Hoy Heath

Rui Xie

Weijun Zhou

Christopher S Letko

Subodh P Jagtap

Kenjiro Ogata

Heather A Spinney

Subodh Jagtap

Embodiments of the present disclosure are directed towards isocyanate reactive compositions that include a polyol and tris(4-hydroxyphenyl)methane alkoxylate.

Isocyanate reactive compositions

Hydroxyl-containing copolymers of butylene oxide and ethylene oxide having a hydroxyl equivalent weight of at least 150, an average of 1.8 to 6 hydroxyl groups per molecule of which hydroxyl groups at least 70% are primary hydroxyl groups and an oxyethylene content of no greater than 10% by weight based on the weight of the copolymer, are useful for making polyurethanes. These polyols are characterized by high reactivity and fast curing times. Polyurethanes made using these polyols have excellent mechanical properties and are highly hydrophobic.

Polyurethane cast elastomers based on poly(butylene oxide) polyols and method for making polyurethane cast elastomers

Polyurethanes are made in a one-shot process from one or more polyols having a hydroxyl equivalent weight of at least 350, wherein at least 50% of the weight of iii) is a hydroxyl-containing polymer of propylene oxide, the hydroxyl-containing polymer of propylene oxide having a hydroxyl equivalent weight of at least 350, an average of 1.8 to 3 hydroxyl groups per molecule of which hydroxyl groups 40 to 70% are primary hydroxyl groups, an oxyethylene content of no greater than 10% by weight based on the weight of the polymer and a polydispersity of 1.175 or less. The polyurethanes exhibit excellent mechanical properties, are highly hygroscopic and cured rapidly.

Polyurethanes and method for making polyurethanes

A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising (i) one or more diisocyanate, polyisocyanate or polyisocyanate prepolymer, (ii) from 40 to 85 wt. % based on the total weight of (i) and (ii) of one or more blocked diisocyanate, polyisocyanate or polyisocyanate prepolymer which contains a blocking agent and has a deblocking temperature of from 80 to 160&#xb0; C., and (iii) one or more aromatic diamine curative. The reaction mixture has a gel time at 80&#xb0; C. and a pressure of 101 kPa of from 2 to 15 minutes; the polyurethane reaction product has a residual blocking agent content of 2 wt. % or less; and the polishing layer exhibits a density of from 0.6 to 1.2 g/cm.

High removal rate chemical mechanical polishing pads and methods of making

Low viscosity mixtures of polysilylated polyethers are described. The mixtures include a) 50 to 95 weight percent of one or more first polysilylated polyethers which are free of urea groups, have an average of two or more terminal hydrolysable silyl groups per molecule and have a molecular weight of 4,000 to 20,000 and 50 to 5 weight percent of one or more second polysilylated polyethers which are free of urea groups, have an average of 1.8 to 4 terminal hydrolysable silyl groups per molecule and have a molecular weight of 1000 to less than 400. The mixtures have surprisingly low viscosities, and are useful as curable components of adhesive, sealant, caulking and/or coating compositions.

Moisture curable polymer systems based on a mixture of polysilylated polyethers

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Pearland, TX, United States of America

Thomas P Willumstad