Intel Corporation

Other

Thomas P Thomas

Ian A Young

Brandon Barnett

Johanna M Swan

Randy B Osborne

Rajesh Kumar

Kishore K Chakravorty

Ganesh Balamurugan

Todd W Mellinger

Joseph F Ahadian

Michael E Griffith

Nasser A Kurd

Stanley Steve Kulick

Valluri Ramana Rao

Mario J Paniccia

Miriam Ruth Reshotko

Camron B Rust

Manpreet Singh Khaira

Robert J Munoz

Kursad Kiziloglu

Michael C Rifani

Erin D Francom

Chaodan Deng

Douglas N Stunkard

John Mark Matson

David Finan

Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

Removable interposer

An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

Distributed electrostatic discharge protection for an on-package input/output architecture

An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched.

Interconnection of multiple chips in a package

An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

On-package input/output architecture

An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched.

Non-linear termination for an on-package input/output architecture

Mechanisms for clock gating. A clock generation circuit provides a clock signal over a clock signal distribution network within an integrated circuit package. Gating elements within the clock signal distribution network disable the clock signal to one or more portions of the clock signal distribution network. A digital locked loop (DLL) maintains settings without tracking when the clock signal is disabled.

Mechanisms for clock gating

An apparatus and system for controlling traffic on an on-chip network. Embodiments of the apparatus comprise single-ended transmission circuitry and single-ended receiving circuitry on a first chip for coupling with a second chip, the transmission circuitry having impedance matching and lacking equalization, the receiving circuitry lacking equalization, the transmission circuitry and the receiving circuitry having statically configurable features and organized in clusters, wherein the clusters have the same physical layer circuitry design for different configurations of the configurable features, the configurable features including half-duplex mode and full-duplex mode, wherein the first chip and the second chip are on the same package, and wherein a plurality of conductive lines for coupling the first chip with the second chip are matched.

On-package input/output clustered interface having full and half-duplex modes

Low power, jitter and latency clocking with common reference clock signals for on-package input/output interfaces. A filter phase locked loop circuit in a master device on a first die provides a clock signal having a frequency of 2F. A local phase locked loop circuit in the master device on the first die is coupled with the filter phase locked loop to provide a clock signal to functional components of the master device through a local clock divider circuit to provide a clock signal of F to the functional components. A remote phase locked loop circuit in a slave device on a second die is coupled with the filter phase locked loop to provide a clock signal to one or more functional components of the slave device through a local clock divider circuit to provide a clock signal of F to the functional components.

Low power, jitter and latency clocking with common reference clock signals for on-package input/output interfaces

A processing device includes a Phase Locked Loop (PLL) system with an adjustable power supply designed to track the power supply provided to one or more of the cores in the processor device. The PLL no longer operates at a fixed voltage level that is held constant and independent from the requested core frequency or the core digital voltage, but rather the power supply to the phase locked loop is adjusted along with the main power supply to the processor core.

Adjusting PLL/analog supply to track CPU core supply through a voltage regulator

An integrated optoelectrical package for optoelectrical integrated circuits (ICs) is disclosed. The package includes a package substrate having contact receiving members on an upper surface. The contact receiving members are electrically connected to contacts on the lower surface. An optoelectronic receiver package and an optoelectronic transmitter package are each electrically mounted to respective first and second subsets of the contact receiving members. Input and output waveguide arrays are formed atop the substrate package and are optically coupled to the optoelectronic receiver package and the optoelectronic transmitter package, respectively. The contacts on the lower surface of the package substrate are designed to contact and engage the contact receiving members of a standard printed circuit board (PCB).

Optoelectrical package

A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.

Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board

A measurement system is provided that includes a probe device having an integrated amplifier. The integrated amplifier may be a transimpedence amplifier that amplifies input current to an output voltage.

Current probe device having an integrated amplifier

A multi-drop bus input/output method and apparatus is disclosed. The apparatus comprises a multi-drop bus that has termination ends. The multi-drop bus also has a characteristic impedance. The multi-drop bus can be used for communication between devices. Devices that are attached to a termination end of the bus drive data onto the bus at the characteristic impedance. Devices that are attached to the bus, but not the termination ends, drive data onto the bus at one-half of the characteristic impedance. An end device terminates to ground with the characteristic impedance, and middle devices have high impedance, when not driving data.

Ground referenced voltage source input/output scheme for multi-drop bus

A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structures in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.

Growing community of inventors

Beaverton, OR, United States of America

Thomas P Thomas