Harris Corporation

Thomas P Smyth

Dennis Lee Tebbe

Charles Michael Newton

Terry Provo

Dara Ruggiero

William Johnson Chappell

Michelle Kay Nelson

Sarah K Mobley

William Dean Killen

Holly Todd

Method for fabricating a textured dielectric substrate () for an RF circuit. The method can include the step () of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter () which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials () into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (). Arranging the dielectric pieces on a base plate () in accordance with the selected pattern to form the textured dielectric substrate.

Method of fabricating an RF substrate with selected electrical properties

Method for fabricating a textured dielectric substrate () for an RF circuit. The method can include the step () of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate pattern () which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials () into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (). Arranging the dielectric pieces on a base plate () in accordance with the selected pattern to form the textured dielectric substrate.

A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may include arranging first and second unsintered ceramic layers and the at least one capacitive structure therebetween. The at least one capacitive structure may include a pair of electrode layers, an inner dielectric layer between the pair of electrode layers, and at least one outer dielectric layer adjacent at least one of the electrode layers and opposite the inner dielectric layer. The at least one outer dielectric layer preferably has a dielectric constant less than a dielectric constant of the inner dielectric layer. The unsintered ceramic layers and the at least one capacitive structure may also be heated, and at least one electronic device may be mounted on the LTCC substrate and electrically connected to the at least one embedded capacitive structure.

Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods

A substrate () for an RF device includes a plurality of layers () of dielectric material cofired in a stack. The plurality of layers () is formed from a material having a permittivity. Selected ones of the layers () have a pattern of perforations () formed in at least one perforated area (). The perforated areas () are generally aligned with one another in the stack to lower one or more of an effective value of a permittivity and a loss tangent in a least one spatially defined region () of the substrate ().

Dielectric substrate with selectively controlled effective permittivity and loss tangent

The method includes selecting two or more types of ceramic materials ( ), each having a distinct set of electrical properties different from the other of the types of ceramic materials. A substrate pattern can also be selected. The substrate pattern can comprise at least two types of distinct substrate areas having the distinct sets of electrical properties of the ceramic materials. Each distinct area can be selected so as to have dimensions much smaller than a wavelength at a frequency of interest. The ceramic materials ( ) can thereafter be fired and then cut into a size and shape consistent with the distinct areas to form dielectric pieces ( ). The process continues by selectively arranging the dielectric pieces on a base plate ( ) in accordance with the pattern to form the textured ceramic dielectric substrate. The completed textured substrate ( ) will have at least one effective electrical property at a frequency of interest that is different from each of said distinct sets of electrical properties of the ceramic materials.

A method for making an RF device, such as an antenna, having a non-planar shape with a high degree of accuracy includes the steps of forming an electrical conductor pattern on a flexible substrate, and positioning the flexible substrate onto the mold having the non-planar shape so that the electrical conductor pattern is exposed. The method also includes forming a rigid layer on the flexible substrate so that the exposed electrical conductor pattern will be transferred to the rigid layer upon separation from the flexible substrate. The rigid layer is separated from the flexible substrate with the electrical conductor pattern remaining on the rigid layer. The method preferably further includes forming an additional thickness of conductive material onto the electrical conductor pattern remaining on the rigid layer. The electrical conductor pattern may be a metal pattern which may be printed onto the substrate. In other embodiments, the electrical conductor pattern on the flexible substrate may be replaced by a seed material that will later be receptive to metal deposition to the define the conductive portions.

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Palm Bay, FL, United States of America

Thomas P Smyth