Medtronic, Inc.

Kyocera Corporation

Medtronic Minimed, Inc.

Thomas P Miltich

Gordon Orvis Munns

Mark D Breyen

Markus W Reiterer

Christian S Nielsen

Brad Conrad Tischendorf

Anthony W Rorvick

Craig L Schmidt

Eric H Bonde

John E Kast

Erik R Scott

Phillip C Falkner

Randy S Roles

Xuan K Wei

Bernard Q Li

Chris J Paidosh

Andrew Jason Thom

Joseph J Viavattine

Reginald D Robinson

Prabhakar A Tamirisa

Joyce Yamamoto

Anthony M Chasensky

Paul A Pignato

Hiroshi Makino

Hidekazu Otomaru

Kengo Morioka

Arne Knudsen

Shingo Satou

Kurt J Casby

Rajesh V Iyer

Richard T Stone

John Daniel Norton

Gabriela C Molnar

Michael Jay Ebert

Todd V Smith

Shawn C Kelley

Simon E Goldman

William L Johnson

Michael E Clarke

Keiichi Fujii

Timothy J Denison

David A Dinsmoor

Randal C Schulhauser

Joseph F Lessar

Duane L Bourget

Joel A Anderson

Mohsen Askarinya

Patrick W Kinzie

Forrest C M Pape

David Probst

Santhisagar Vaddiraju

Stephen J Roddy

Daniel Hahn

James D Reinke

John Louis Sommer

Kenneth C Gardeski

William John Taylor

Timothy T Bomstad

Larry Earl Tyler

Thomas M Nutzman

Joseph M D'Sa

Jeffrey O York

Andrew J Ries

Steven Joseph May

Paul B Young

Angela Rodgers

Takahito Hirata

Markus W Réitérer

An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

Waferscale physiological characteristic sensor package with integrated wireless transmitter

A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Minimally invasive implantable neurostimulation system

A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.

An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.

A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.

Hermetic feedthrough for an implantable medical device

A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.

Method of manufacturing a feedthrough

An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.

In one example, a filtered feedthrough assembly for a medical device, such as, e.g., an implantable medical device, is described. The filtered feedthrough assembly may comprise a feedthrough comprising at least one feedthrough conductive pathway extending between a first feedthrough side and a second feedthrough side; a capacitive filter array comprising at least one filter array conductive pathway extending between a first filter array side and a second filter array side, and at least one capacitor filter substantially surrounding at least a portion the at least one filter array conductive pathway; and at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway.

Capacitive filtered feedthrough array for implantable medical device

Growing community of inventors

Otsego, MN, United States of America

Thomas P Miltich