Motorola Corporation

Thomas P Kirby

John E Herrmann

Due Quoc Huynh

Micheal M Austin

David H Rubin

Jonathon G Greenwood

Ovidiu Neiconi

Christopher Lee Becher

Edward Juchniewicz

A leaded component (10) is provided with first and second leads (14 & 16). The leads are formed with stopping deviations (26 & 28) which prevent the leads from being inserted into a circuit board (38) beyond the stopping deviations. The leads may also be provided with retaining deviations (34 & 36) which function to retain the component on the circuit board. Further, the stopping deviations may be formed so as to indicate the polarity of a component, and finally, the stopping deviations may be provided with mounting portions (50 & 52) so that the leaded component may be surface mounted on a circuit board (54).

Electrical component having formed leads

A station (10) in a manufacturing line (12) for the accurate placement of solder balls (30) on a ball grid array package and for the removal of excess solder balls comprises a substrate (4) having an array of solder pads (7), and an adhesion layer (8) on the solder pads. The station further comprises a stencil (16) placed on top of the substrate and having a height between 1/4 times the diameter of one of the solder balls and 5/4 times the diameter of one of the balls, the stencil having an array of apertures (18) corresponding to the array of solder pads and substantially exposing each of the solder pads of the array, a pallet (2) for holding and transporting the substrate to the stencil and further along the manufacturing line, a dispenser (26) for pouring solder balls in bulk over the stencil, a vibration device (20) coupled to the station for urging the solder balls into the apertures of the stencil and onto the adhesion layer above the solder pads, and a moving directed column of air (24) across the surface of the stencil to remove excess solder balls from the stencil.

Method and apparatus for solder sphere placement using an air knife

A robotic placement device (FIG. 1) comprises a programmable end-effector (200) for picking and placing component parts. The programmable end-effector (200) comprises a cylinder (201) having a piston (202) including a first (203) and second (208) shafts coupled together. The first shaft (203) of the piston is larger than the second shaft (208). A controller (102) controls a pressure applied to the cylinder (201) and the piston (202) including the first (203) and second (208) shafts of the programmable end-effector (200) establishes a predetermined placement force at the programmable end-effector (200) while placing component parts. A control circuit 118 senses the pressure and in response thereto generates a signal. A processor 108 coupled to the controller (102) processes the signal and in response thereto varying the pressure for maintaining a substantially constant placement force at the programmable end-effector (200) while the programmable end-effector (200) moves vertically.

Circuit assembly device for programmably controlling placement force and

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Boynton Beach, FL, United States of America

Thomas P Kirby