Bae Systems Information and Electronic Systems Integration Inc.

Dedicated Electronics

Thomas O Perkins, Iii

Stephen J Uurtamo

Michael Richard Ehlert

Candice L Brittain

Ronald H Schmidt

John C Joseph

Blair E Coburn

Peter M Wallace

Dennis P Glynn

A system is provided for the integration of microwave components in a low temperature co-fired ceramic, the system includes a low temperature co-fired ceramic body having a top surface, into which is disposed a plurality of cavities; a plurality of microwave devices, each device being disposed within a cavity such that the cavities provide radio isolation to the devices; and a coaxial connection disposed within the body configured to connect the devices to external components the coaxial components comprising vias disposed within the co-fired ceramic body.

Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology

An X-band, crossed dipole turnstile antenna configured to be omni-directional with horizontal polarization is disclosed. It comprises a set of two dipole antennas aligned at right angles to each other attached to a common 50 ohm coaxial feedpoint and fed 90 degrees out-of-phase. The antenna pattern is nearly omnidirectional in the horizontal plane. The antenna can be used generally in microwave communications including Digital Radio Frequency Tags (DRaFTs) communicating with airborne and satellite platforms.

X-band turnstile antenna

An X, K, and K-band omni-directional antenna with dielectric loading is disclosed. It comprises a conductor with a loading dielectric resonator and a ground plane. Broad frequency coverage from 7.5 to 26 GHz includes uniform azimuthal coverage from +10 to +70 degrees. The antenna can be used generally in microwave communications including Digital Radio Frequency Tags (DRaFTs) communicating with airborne and satellite platforms.

[object Object]

A system is provided for rapidly prototyping monolithic microwave integrated circuit modules to provide an experimental structure that can be physically made to operate by stereolithographically rendering an SLA part directly from the designer's drawings and by coating the part with a conductive layer, with the smoothness being better than 0.001 inch and with the dimensional accuracy being better than 3 mils for some applications. In one embodiment, the coating for the SLA model is made from either rhodium or gold having a thickness of less than 1/10,000of an inch, with a nickel barrier being first deposited followed by the gold. The particular SLA plastic is a high temperature plastic to prevent bubbling during the metal deposition step which in one embodiment involves sputtering. The coated model has a microfinish of Ra&#x3c;0.001 inch, with active devices being electrically attached to the coating through the use of conductive adhesives or eutectic solder. This provides a device in which active devices are attached to the layer without soldering and without introduction of heat which might destroy the metallized layer and alter and the critical dimensions.

Method and apparatus for rapid prototyping of monolithic microwave integrated circuits

The disclosure defined by this invention utilizes electromagnetic energy reflected from the top and bottom surfaces of ice, the thickness of which is being measured, to determine a phase difference that indicates the thickness of the ice. Since there will be many wave lengths of the electromagnetic energy in the ice, two measurement frequencies are utilized. Integers of wavelengths of each frequency are added to the readings for each frequency to derive sets of numbers. The one number in the set of readings for each frequency that are the same in each set indicate the actual thickness of the ice.

Growing community of inventors

Bedford, NH, United States of America

Thomas O Perkins, Iii