Speedline Technologies, Inc.

Thomas Nowak, Jr

Jeffrey P Fugere

Gary T Freeman

Thomas Purcell

Cord W Ohlenbusch

Richard F Foulke, Jr

Richard F Foulke

A Jason Mirabito

Jules Gordon

David Thurlow

Kevin Avery

Francis M Beals

Thomas M Sullivan

An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places spheres at locations on the substrate. The placement station includes a first container having a chamber to contain spheres, and a first carrier tray having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes formed therein to receive spheres. The first carrier tray is movable to position the second section between a fill position beneath the first container and a place position disposed over the first sphere placement position. The placement station is constructed and arranged to fill the plurality of holes with spheres when the second section is in the fill position, and place the spheres at the predetermined positions on the substrate when the second section is in the place position.

Method and apparatus for placing solder balls on a substrate

The present invention provides a method and apparatus for dispensing materials onto a substrate. In one embodiment, a dispensing system includes a controller, a vacuum source in electrical communication with the controller, the vacuum source applying a vacuum to at least a portion of the substrate in response to an instruction from the controller, an injector in electrical communication with the controller, the injector comprising a valve in communication with a pressure source and a material port in communication with a material source, the valve permitting material from the material source to be dispensed onto a substrate in accordance with an instruction from the controller. In one embodiment, the dispensing system also includes a trap in communication with the vacuum source, where the trap substantially prevents excessive material dispensed by the injector from contacting the vacuum source.

Conveyorized vacuum injection system

The present invention provides a method and apparatus for dispensing materials onto a substrate in a vacuum. In one embodiment, a dispensing system includes a dispensing vacuum chamber having an inlet to receive substrates for dispensing and an outlet to provide substrates having material dispensed thereon, a dispensing pump, disposed within the dispensing vacuum chamber, that dispenses the material onto substrates, a substrate support system, disposed within the dispensing vacuum chamber, that supports substrates at a dispensing position beneath the dispensing pump, an inlet vacuum chamber coupled to the inlet of the dispensing vacuum chamber, and an outlet vacuum chamber coupled to the outlet of the dispensing vacuum chamber.

Method and apparatus for dispensing materials in a vacuum

Growing community of inventors

N. Hampton, NH, United States of America

Thomas Nowak, Jr