Qualcomm Incorporated

Other

Qualcomm Mems Technologies, Inc.

Thomas Myers

Guy Klemens

Mohammad Ali Tassoudji

Gurkanwal Singh Sahota

Nathan M Pletcher

Aristotele Hadjichristos

Babak Nejati

Zhang Jin

Norman L Frederick, Jr

Seong Heon Jeong

Rajneesh Kumar

Kevin Hsi Huai Wang

Darryl Sheldon Jessie

Neil Burns

Taesik Yang

Yu Zhao

Maulin Pareshbhai Bhagat

Julio Zegarra

Clinton James Wilber

Jeong Il Kim

Jordan Szabo

Wallace C Myers, Sr

Jonghae Kim

Mario Francisco Velez

Evgeni Petrovich Gousev

Je-Hsiung Lan

Ravindra Vaman Shenoy

Bhushan Shanti Asuri

Aleksandar Miodrag Tasic

Chi Shun Lo

Yu-Chin Ou

Puay Hoe See

Marco Cassia

Junxiong Deng

Jorge Fabrega Sanchez

Justin Phelps Black

Aristotle Hadjichristos

Hongyan Yan

Mohammad Farazian

David Bang

Ockgoo Lee

Abbas Abbaspour-Tamijani

Lan Nan

Jeong Ii Kim

James R Mensing

James A Pollet

Norman L Frederick

An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

Antenna and device configurations

Antenna module configurations

In an aspect, an apparatus may be an apparatus for wireless communication. The apparatus for wireless communication may include a transceiver, a memory, and at least one processor coupled to the memory and configured to execute instructions stored in the memory to control the transceiver. In another aspect, an apparatus may be an apparatus for wireless communication. The apparatus for wireless communication may include a patch antenna coupled to the transceiver. The patch antenna includes a patch, a ground plane substantially located with respect to the patch, a probe feed coupled to the patch, and a slot-coupled feed configured to couple to the patch.

Hybrid feed technique for planar antenna

A tunable guard ring for improved circuit isolation is disclosed. In an exemplary embodiment, an apparatus includes a closed loop guard ring formed on an integrated circuit and magnetically coupled by a selected coupling factor to a first inductor formed on the integrated circuit. The apparatus also includes a tunable capacitor forming a portion of the closed loop guard ring and configured to reduce magnetic field coupling from the first inductor to a second inductor.

Tunable guard ring for improved circuit isolation

This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.

Integrated passives and power amplifier

A multi-mode multi-band power amplifier (PA) module is described. In an exemplary design, the PA module includes multiple power amplifiers, multiple matching circuits, and a set of switches. Each power amplifier provides power amplification for its input signal when selected. Each matching circuit provides impedance matching and filtering for its power amplifier and provides a respective output signal. The switches configure the power amplifiers to support multiple modes, with each mode being for a particular radio technology. Each power amplifier supports at least two modes. The PA module may further include a driver amplifier and an additional matching circuit. The driver amplifier amplifies an input signal and provides an amplified signal to the power amplifiers. The additional matching circuit combines the outputs of other matching circuits and provides an output signal with higher output power. The driver amplifier and the power amplifiers can support multiple output power levels.

Multi-mode multi-band power amplifier module

A semiconductor die has multiple discontinuous conductive segments arranged around a periphery of the semiconductor die, and an electrically insulating barrier within discontinuities between the conductive segments. The conductive segments and the barriers form a mechanically continuous seal ring around the semiconductor die.

Electrically broken, but mechanically continuous die seal for integrated circuits

A compact integrated power amplifier is described herein. In an exemplary design, an apparatus includes (i) an integrated circuit (IC) die having at least one transistor for a power amplifier and (ii) an IC package having a load inductor for the power amplifier. The IC die is mounted on the IC package with the transistor(s) located over the load inductor. In an exemplary design, the IC die includes a transistor manifold that is placed over the load inductor on the IC package. The transistor(s) are fabricated in the transistor manifold, have a drain connection in the center of the transistor manifold, and have source connections on two sides of the transistor manifold. The IC die and the IC package may include one or more additional power amplifiers. The transistor(s) for each power amplifier may be located over the load inductor for that power amplifier.

Integrated power amplifier with load inductor located under IC die

An integrated circuit is described. The integrated circuit includes an inductor that has a large empty area in the center of the inductor. The integrated circuit also includes additional circuitry. The additional circuitry is located within the large empty area in the center of the inductor. The additional circuitry may include a capacitor bank, transistors, electrostatic discharge (ESD) protection circuitry and other miscellaneous passive or active circuits.

Methods and apparatus for inductors with integrated passive and active elements

An output circuit with integrated impedance matching, power combining, and filtering and suitable for use with power amplifiers and other circuits is described. In an exemplary design, an apparatus may include first and second circuits (e.g., power amplifiers) and an output circuit. The first circuit may provide a first single-ended signal and may have a first output impedance. The second circuit may provide a second single-ended signal and may have a second output impedance. The output circuit may include (i) first and second matching circuits that perform output impedance matching and filtering for the first and second circuits, (ii) a combiner (e.g., a summing node) that combines the first and second single-ended signals to obtain a combined single-ended signal, (iii) a third matching circuit that performs impedance matching and filtering for the combined single-ended signal, and (iv) switches to route the single-ended signals to different outputs.

Output circuit with integrated impedance matching, power combining and filtering for power amplifiers and other circuits

A balloon pump includes a cylinder having an outlet end and a piston adapted to reciprocate within the cylinder. One-way outlet and inlet valves are associated with the pump for allowing air to exit the cylinder outlet end only when the piston moves toward the outlet end and enter the cylinder only when the piston reciprocates away from the cylinder outlet end. An elongated piston drive member or base is connected at one end to the piston with the other end extending out of the cylinder at the end opposite the cylinder outlet end. A biasing arrangement acts between the cylinder and the piston to bias the piston away from the outlet end of the cylinder. With the pump positioned vertically and supported on the elongated piston drive member, the biasing arrangement raises the cylinder to perform a return stroke so that the pump may be operated simply by pushing down on the cylinder.

Balloon pump

Balloon pump or similar article

An engine apparatus is adapted to operate upon partial immersion in a heated liquid in a liquid reservoir. A movably mounted frame is mounted to a fixed frame and located adjacent the liquid reservoir in a manner that heat exchangers attached to the movable frame are successively passed into the liquid of the liquid reservoir. The heat exchangers are connected in pairs on opposite sides of the movable frame and contain a low boiling point liquid therein. Each heat exchanger of each pair is connected to the other through a pair of drive cylinders, so that the expansion of the fluid in the heat exchanger passing through the liquid reservoir and the simultaneous contraction of fluid in the heat exchanger that has left the reservoir expands and contracts the drive cylinders to operate the engine. The engine will operate from a low temperature heated liquid such as may be provided by solar panels or water heat from power plants.

Engine apparatus

An agricultural harvesting assembly designed to remove vines and like undesirable growth from cultivated trees, plants and the like, comprising a frame movably and adjustably attachable to a tractor or like towing vehicle. A gripping head is movable and adjustably attached to the frame by an orienting means movably interconnected between the gripping head and the frame in such a manner as to absorb shock when the gripping head engages a tree from which vines are to be removed. Head disposition means and additional adjustment means are mounted on said frame and movably interconnected relative to the gripping head so as to position the gripping head between an operative and non-operative position and also in predetermined path of travel relative to a tree or obstacle intended to be encountered.

Agricultural harvesting assembly

Growing community of inventors

San Diego, CA, United States of America

Thomas Myers