Hymite A/s

Taiwan Semiconductor Manufacturing Comp. Ltd.

Infineon Technologies Ag

TSMC Solid State Lighting Ltd.

Epistar Corporation

Osram Gmbh

Thomas Murphy

Matthias Heschel

Andreas Alfred Hase

Volker Plickert

Lutz Melchior

Herwig Stange

Manfred Deisenhofer

Olaf BÜTTNER

Wolfgang Benten

A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.

Package for a light emitting element

A submount for an optoelectronic device includes a substrate, a first top pad on a top surface of the substrate, a first bottom pad on a bottom surface of the substrate and a first wrap-around contact in a sidewall recess of the substrate, in which the first wrap-around contact is coupled electrically to the first top pad and to the first bottom pad. Alternatively, or in addition, the submount includes a device mounting pad on the top surface of the substrate, a wire-bond pad on the top surface of the substrate, a contact pad on the bottom surface of the substrate and a feedthrough contact which extends through the substrate and electrically couples the wire-bond pad to the contact pad.

Optoelectronic device submount

A package includes a substrate with a recess in which a light emitting element is mounted. A surface of the substrate forms an exterior surface of the package. A lid may be attached to the substrate to define a sealed region in which the light emitting element is mounted. The lid is transparent to a wavelength of light emitted by the light emitting element. Electrostatic discharge protection circuitry in the substrate is electrically coupled to the light emitting element.

Package for a light emitting element with integrated electrostatic discharge protection

A configuration for coupling optical signals of at least one optical data channel into and/or out of an optical waveguide carrying optical signals of at least two optical data channels includes at least two optical waveguide sections forming the optical waveguide, the sections positioned axially one behind the other, at least core regions of two optical waveguide sections being positioned one behind the other separated from one another by a free-radiating region, an end face of at least one waveguide section running obliquely with respect to an optical axis () of the waveguide and being coated with a wavelength-selective filter, and, for a specific optical data channel, light being coupled into or out of the optical waveguide by reflecting light of the optical data channel, before or after traversing the free-radiating region, at the end face of the optical waveguide section running obliquely with respect to the optical axis.

Configuration for coupling optical signals of at least one optical data channel into and/or out of an optical waveguide

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Berlin, Germany

Thomas Murphy