Core Scientific, Inc.

Core Scientific Operating Company

Cypress Semiconductor Corporation

Thomas Middleton Rutledge Fuller

Lawrence Kom

Devon Baldwin

Cole D Wilson

Louis W Bokma

Andrew Best

Mark R Lee

Harsh Patel

Kamil Lazarowich

Jacob Taylor

Richard Dunne

A system for improved air cooling of circuit boards such as cryptographic hash boards is disclosed. The system may comprise a tubular case and a number of circuit board support brackets affixed to the inside of the case in a radial pattern. Fans may be coupled to one or both ends of the tubular case to draw air through the tubular case. The tubular case may be cylindrical or a regular polygonal prism and may have a central channel for cables and controller cards.

System for cooling circuit boards

A method of computer operation may include (a) providing a first computer and a second computer; (b) operating the second computer; (c) modifying settings of the second computer; (d) monitoring, via the first computer, changes to a plurality of operational parameters of the second computer after the settings are modified to identify a plurality of covariant parameters of the plurality of operational parameters; and/or (e) controlling, via the first computer, operation of the second computers according to the identified plurality of covariant parameters to increase computational efficiency of the second computer.

Method and system of optimizing the performance of a second computer by a first computer

A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack. The air barrier may have openings for the computing devices to permit exhaust air to flow through the air barrier into a hot aisle. The rack maybe configured to be connected to other similar racks to form a vertical annular hyperboloid or a vertical hyperbolic annular paraboloid, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular hyperboloid or a vertical hyperbolic annular paraboloid to improve airflow.

Rack for cooling computing devices in a hyperboloid configuration

Systems and methods for managing airflow for cooling computing devices (e.g., in a data center) are disclosed. To prevent damage to computing devices after power outages in low temperatures, a subset of the computing devices may be preheated, started, and operated in an exhaust air recirculation mode to raise the temperatures of the other computing devices. Preheating may for example use heaters or warm air temporarily diverted from external sources such as nearby buildings. Thermal mass (e.g., phase change material) may be positioned near the computing devices to capture heat that is later released in the event of a dramatic temperature drop such a cold weather power outage.

Thermal management for container-based data centers

A facility (e.g., data center) for more efficient cooling of computing devices is disclosed. In one embodiment, the data center comprises a set of external walls, a ceiling connected to the external walls and having circular exhaust openings, and one or more pods positioned within the external walls and below the ceiling. A set of flexible tubes are used to connect the pod exhaust openings to the ceiling openings. Actuating closures may be used (e.g., at one end of each of the tubes) to control airflow, and air pressure sensors may be placed near or inside one or more of the tubes. A controller may be configured to receive air pressure data from the air pressure sensors and adjust the actuating closures to maintain a desired air pressure level. In some examples, the actuating closure may have a normally closed position when power is not applied.

Data center cooling

A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack and have openings that permit exhaust air to flow from the computing devices through the air barrier into a hot aisle. The rack may be configured to be connected to other similar racks to form a vertical annular cylinder, which may be tapered, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular cylinder to improve airflow.

Rack for cooling computing devices in a cylindrical configuration

A first capacitor and a second capacitor are charged until voltage at the second capacitor settles to a settling voltage. While charging, the first capacitor is alternately switched between a current source and ground. When the settling voltage is reached, charging of the first capacitor is halted. The second capacitor continues to be charged until voltage at the second capacitor reaches a reference voltage. The amount of time it takes for the settling voltage to reach the reference voltage corresponds to a measure of capacitance on the first capacitor.

Growing community of inventors

Seattle, WA, United States of America

Thomas Middleton Rutledge Fuller