Air Products and Chemicals, Inc.

Thomas Michael Wieder

Madhukar Bhaskara Rao

Wen Dar Liu

Yi-Chia Lee

Aiping Wu

Gautam Banerjee

Jennifer M Rieker

Matthew I Egbe

Michael Walter Legenza

Dana L Durham

The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.

Water-rich stripping and cleaning formulation and method for using same

A composition comprising one or more water soluble organic solvents comprising a glycol ether; water; a fluoride containing compound provided that if the fluoride containing compound is ammonium fluoride than no additional fluoride containing compound is added to the composition; optionally a quaternary ammonium compound; and optionally a corrosion inhibitor is disclosed herein that is capable of removing residues from an article such as photoresist and/or etching residue. Also disclosed herein is a method for removing residues from an article using the composition disclosed herein.

Composition for stripping and cleaning and use thereof

Compositions containing certain amines and/or quaternary ammonium compounds, hydroxylamine, corrosion inhibitor, organic diluent and optionally water are capable of removing photoresist, photoresist byproducts and residue and etching residues from a substrate.

Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof

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Emmaus, PA, United States of America

Thomas Michael Wieder