Air Products and Chemicals, Inc.

Versum Materials Us, LLC

Thomas Mebrahtu

Tianniu Chen

Wen Dar Liu

Yi-Chia Lee

Aiping Wu

Gene Everad Parris

Ranajit Ghosh

Daniel James Gibson

Jeffrey Alan Knopf

Kevin John Giardiniere

Edward Chia Kai Tseng

Kevin J Giardiniere

A composition and method using same useful for etching a semiconductor substrate comprising: from about 25 to 86% by weight of water; from about 0 to about 60% by weight of a water-miscible organic solvent; from about 1 to about 30% by weight of a base comprising a quartenary ammonium compound; from about 1 to about 50% by weight of an amine compound wherein the amine compound is selected from the group consisting of a secondary amine, a tertiary amine, and mixtures thereof; from about 0 to about 5% by weight of a buffering agent; from about 0 to about 15% by weight of a corrosion inhibitor.

Etching compositions and methods for using same

A method and apparatus for discharging a temperature-controlled flow of a resultant fluid () containing a throttling gas and cryogenic fluid onto a material () for the purpose of maintaining the temperature of the material within a desired temperature range and below the glass transition temperature of the material during machining. Also disclosed is an apparatus and method for deburring or deflashing a machined material by discharging a temperature-controlled flow of a resultant fluid () onto a machined material () to harden the burrs (), then brushing the material () to remove the hardened burrs ().

Apparatus and method for machining polymers with controlled croygenic cooling

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Lansdale, PA, United States of America

Thomas Mebrahtu