Lsi Logic Corporation

Thomas Mathews Antisseril

Bo Shen

Prasad Subbarao

Radoslav Ratchkov

Maad A Al-Dabagh

Hiroshi Ishikawa

Anwar Ali

Benjamin Mbouombouo

Michael Norris Dillon

David W Vinke

Bret Alan Oeltjen

Charutosh Dixit

Ruben Salvador Molina

Julie Beatty

Qiong J Yu

Uday Anumalachetty

An integrated circuit structure for distributing power to one or more standard cells in an integrated circuit includes a first plurality of standard cells and a power mesh power connection structure coupled to the cells. Each of the standard cells includes first and second power rails adapted for connection to a voltage supply and a voltage return, respectively, of the standard cells. Each standard cell in a subset of the standard cells is arranged in direct abutment with at least two other standard cells, and at least first and second end cells are arranged in direct abutment with at least one other standard cell of the first plurality of standard cells. The power mesh power connection structure includes a plurality of conductive elements formed in a plurality of different conductive layers in the integrated circuit. The power mesh power connection structure is operative to connect the first and second power rails of the first plurality of standard cells to the voltage supply and voltage return, respectively, and is configured so as to reduce a first voltage differential between respective first power rails of the standard cells and to reduce a second voltage differential between respective second power rails of the standard cells.

Enhanced power distribution in an integrated circuit

A multiple layer power mesh design includes an L-shaped structure and a bow tie-shaped structure. The L-shaped structure provides a plurality of L-shaped power rails in each of four quadrants of the layer. The bow tie-shaped structure includes plurality of vertical power rails in each of a left and right triangularly-shaped portion of the layer. The vertical power rails of the bow tie-shaped structure provide and interface between the upper and lower quadrants of the L-shaped layer. The bow tie-shaped structure provides additional available space which can, for example, be used for routing signal traces. A T-shaped structure is also provided for use with the bow tie-shaped layer. The T-shaped layer provides for improved distances between the VDD and the VSS power rails.

Bowtie and T-shaped structures of L-shaped mesh implementation

A method for checking power errors in an ASIC design is disclosed. The method includes providing a power checker software program with one or more power checker modules that each check a particular type of power element in the ASIC design. A power checker database is created that stores the following: individual power elements in the ASIC design, a connectivity graph of the power elements, and location bins corresponding to physical areas in ASIC design that identify the power elements that are located within each area. The method further includes providing a user with a choice of which power elements in the design to check, and executing the power checker modules corresponding to the selected power elements in order to check for errors in the selected power elements. Finally, any detected errors are output for the user.

Method and system for checking for power errors in ASIC designs

A multiple layer mesh design which includes a layer which provides a vertical mesh and an adjacent layer which provides a horizontal mesh which includes an open area or hole. The layer which provides the horizontal mesh (with hole) may either be above or below the vertical mesh layer, depending on the design. The vertical mesh may be full or may surround an open area or hole where the design includes both a horizontal donut mesh and a vertical donut mesh.

Donut power mesh scheme for flip chip package

A rectangular termination ring for a power distribution mesh is placed on the upper two layers of an integrated circuit and may be placed over some I/O circuitry. The strapping connecting the bonding pads to the termination ring are placed on upper levels of the integrated circuit, minimizing the via requirements and freeing space for additional circuitry. Further, the termination ring may be adapted to work in conjunction with L-shaped, as well as other power distribution meshes.

Termination ring for integrated circuit

Growing community of inventors

San Ramon, CA, United States of America

Thomas Mathews Antisseril