Corning Incorporated

Medtronic, Inc.

Other

Picosys Incorporated

Invenios Inc

Thomas M Wynne

Raymond Miller Karam

David A Ruben

Georges Roussos

Michael S Sandlin

Anthony Thomas Chobot

Dragan Pikula

Paul Michael Then

Joseph Marshall Kunick

Jann Paul Kaminski

Raymond M Karam, Ii

Ian Armour McKay

Kee Siang Goh

John D Duke

Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.

Kinetically limited nano-scale diffusion bond structures and methods

A liquid lens can include a cavity, a first liquid disposed within the cavity, and a second liquid disposed within the cavity. A focus of the liquid lens can be adjustable by adjusting a shape of a variable interface defined by the first liquid and the second liquid. Upon adjusting the focus of the liquid lens in a periodic oscillation with a peak-to-valley amplitude of 20 diopter and a frequency of 2 Hz, a root mean square (RMS) wavefront error (WFE) of the liquid lens measured at 1 ms intervals can remain at 100 nm or less throughout one complete cycle of the periodic oscillation.

Variable lenses with improved image quality during continuous focus, video recording devices, and systems and methods comprising the same

A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.

Method of bonding substrates and separating a portion of the bonded substrates through the bond, such as to manufacture an array of liquid lenses and separate the array into individual liquid lenses

A liquid lens can tilt a fluid interface, such as for optical image stabilization or off-axis focus. Tilting the interface can cause coma aberration or other dynamic wavefront error. The liquid lens can be driven to reduce the coma aberration or other dynamic wavefront error. For example, input shaped signals can be used. In some cases, the signals can be overdriven and/or underdriven, which can increase response time, and/or encourage settling of the interface.

Liquid lens interface control systems and methods

A liquid lens system includes first and second liquids disposed within a cavity. An interface between the first and second liquids defines a variable lens. A common electrode is in electrical communication with the first liquid. A driving electrode is disposed on a sidewall of the cavity and insulated from the first and second liquids. A controller supplies a common voltage to the common electrode and a driving voltage to the driving electrode. A voltage differential between the common voltage and the driving voltage is based at least in part on at least one of: (a) a first reference capacitance of a first reference electrode pair disposed within the first portion of the cavity and insulated from the first liquid or (b) a second reference capacitance of a second reference electrode pair disposed within the second portion of the cavity and insulated from the first liquid and the second liquid.

Liquid lenses and methods for operating liquid lenses

Embodiments generally relate to chips containing one or more hermetically sealed chambers that may be dismantled under controlled conditions using a release technique. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Chips with hermetically sealed but openable chambers

Embodiments generally relate to apparatus and methods for dismantling a hermetically sealed chamber. In one embodiment, an apparatus facilitating the opening of a hermetically sealed chamber in a device comprises a fixture configured to hold the device, and a system configured to create sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. In one embodiment, a method for opening a hermetic seal between first and second elements forming a chamber in a microfluidic chip comprises using a release technique creating sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. The release technique comprises introducing a tool to the vicinity of the interface without any contact between the tool and any material within the chamber. The breaking of the seal results in the complete separation of the first and second elements.

Methods to dismantle hermetically sealed chambers

Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Growing community of inventors

Santa Barbara, CA, United States of America

Thomas M Wynne