Texas Instruments Corporation

Thomas M Wolf

Scott William Jessen

Zhijian Lu

The present invention provides a method for manufacturing an interconnect and a method for manufacturing an integrated circuit including the interconnect. The method of manufacturing an interconnect, among other steps, includes forming a via () in a substrate () and then forming a base getter material () in the via (). The method further includes forming a photoresist layer () over the base getter material (), the photoresist layer () having an opening () therein positioned over the via (), and etching a trench () into the substrate () using the opening () in the photoresist layer ().

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Allen, TX, United States of America

Thomas M Wolf