Amp LLC

The Whitaker Corporation

Thomas M O'Shea

Francis F Koblitz

Lynn K Snyder

Thomas J Lynch

Ronald B Barnes

Paul F Engle

Ram K Agnihotri

Roger T Banks

Joseph J Yula

Russell T Lerch

Beverly A Stoner

Earl Hennenhoefer

John Yavor

An additive electrical circuit (5) on a flexible substrate (1) fabricated by; metallization of the substrate, applying a mask pattern comprising a plating resistant material, applying a conductive circuit material in a circuit pattern that is uncovered by the mask pattern, and removing the plating resistant material and the metallization. Leaving the circuit (5) on the substrate (1) to be applied as a harness or instrument panel.

Process for low density additive flexible circuits and harnesses

An electrical connector of the type having a housing with terminals extending from apertures thereof, is sealed at the aperture entrances around the extending terminal portions. The sealant material is polymerized of a major proportion of at least one vinyl ester resin, a minor proportion of at least one polymerizable acrylic diluent monomer and a polymerization activation system comprising from about 0.025% to about 17% by weight of the resin, by being exposed to actinic radiation selected to activate the system. The polymerized material excludes solder and solvents from the aperture entrances.

Method of sealing electrical connectors using a broad spectrum light and

A sealant material that is relatively chemically inert toward plastics and adhesives is comprised of a homogeneous mixture of polymeric polyester, said polyester being derived from adipic acid, and silica, the polyester comprising more than about 50 percent by weight of the mixture and the fumed silica comprising less than about 20 percent by weight of the mixture. In a preferred embodiment, the sealant material further contains an organofunctional silane coupling agent, a polyfunctional bridging agent, a dispersing agent and a fluorosurfactant.

Electrical connector containing adipic acid polyester sealant composition

A dielectric composition capable of being polymerized for use in sealing electrical and electro-optical connectors and devices is disclosed. Said composition is comprised of a major proportion of vinyl ester resins, a minor proportion of polymerizable acrylic diluent monomers, and a polymerization activation system comprised of from about 0.25 percent to about 17 percent by weight of the resin. A process of the present invention includes applying a layer of said composition to desired areas or to desired locations such as apertures surrounding electrical terminals extending from a connector housing, and exposing said composition to actinic radiation which activates the polymerization activation system which causes the composition to polymerize to form a sealant material that exclused solder and solvents from the connector and its apertures.

Broad spectrum light and heat curable sealant composition and method of

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York, PA, United States of America

Thomas M O'Shea