Sandia Corporation

National Technology & Engineering Solutions of Sandia, LLC

Thomas M Gurrieri

Jason Hamlet

Lyndon G Pierson

Todd Bauer

Ryan Helinski

Randolph R Kay

David V Campbell

Michael L Holmes

Kenneth Wojciechowski

Darwin K Serkland

Seethambal S Mani

Dahwey Chu

James Ewers Levy

Subhash L Shinde

Jeffrey L Rienstra

Joy M Barker

Robert Lovejoy

William S Cavanaugh

An integrated circuit (IC) based physically unclonable function (PUF) that comprises a common source amplifier for generating PUF output voltages, a unity gain, negative feedback operational amplifier for generating bias voltages, a voltage regulator and a bit exclusion circuit that excludes unstable PUF bits. Compensation circuitry built into the IC-PUF provides a high power supply rejection ratio and enables highly reliable operation of the IC-PUF across varying input voltages and operating temperatures. The IC-PUF generates a uniformly random output bit stream by taking advantage of process variations that are inherent to the fabrication of (metal-oxide semiconductor) MOS transistors.

Integrated circuit physically unclonable function

Generating a physically a physically unclonable function ('PUF') circuit value includes comparing each of first identification components in a first bank to each of second identification components in a second bank. A given first identification component in the first bank is not compared to another first identification component in the first bank and a given second identification component in the second bank is not compared to another second identification component in the second bank. A digital bit value is generated for each comparison made while comparing each of the first identification components to each of the second identification components. A PUF circuit value is generated from the digital bit values from each comparison made.

Area-efficient physically unclonable function circuit architecture

A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

Focal plane array with modular pixel array components for scalability

An electronic device includes a memory configured to receive data representing light intensity values from pixels in a focal plane array and a processor that analyzes the received data to determine which light values correspond to triggered pixels, where the triggered pixels are those pixels that meet a predefined set of criteria, and determines, for each triggered pixel, a set of neighbor pixels for which light intensity values are to be stored. The electronic device also includes a buffer that temporarily stores light intensity values for at least one previously processed row of pixels, so that when a triggered pixel is identified in a current row, light intensity values for the neighbor pixels in the previously processed row and for the triggered pixel are persistently stored, as well as a data transmitter that transmits the persistently stored light intensity values for the triggered and neighbor pixels to a data receiver.

Smart trigger logic for focal plane arrays

Growing community of inventors

Albuquerque, NM, United States of America

Thomas M Gurrieri