Honeywell G.m.b.h.

Thomas M Europa

James Roy Troxel

Mark Dean Smith

Robert Stebbins Doyle

Kenneth L Snodgrass

Glenn B Oborn

An improved electrical circuit particularly adapted to operate in an extremely thin atmosphere such as above fifty thousand feet. The circuitry of the invention is preferably formed on a circuit board and has an exposed conductive element such as a harmonic filter. This exposed conductive element is encased by a thin dielectric which is preferably formed using a solder mask having dielectric properties which prevent the conductive element from creating a corona during electrical operation in the contemplated thin atmosphere. In the preferred embodiment, the solder mask has a thickness of less than 0.002 inches and exhibits a dielectric strength of at least 1000 V/0.001 inch. The solder mask, for the preferred embodiment, is positioned to cover the conductive element and extends onto the circuit board only minimally.

Mechanism for elimination of corona effect in high power RF circuitry at

A multi-layered printed wiring board for high frequency application includes a first board of polytetrafluoroethylene (PTFE) having a metallic sheet on each side. The first side is etched to form high frequency circuity using micro-strip technology and the second side being a metallic sheet forming the ground plane. Laminated to the ground plane of the first board is a fiberglass board of thickness, A. Further, laminated to the fiberglass board is a second board of fiberglass having a thickness, A. The second board also has metallic sheets on both side, the side being laminated to the fiberglass board being etched to form strips, prior to being laminated, forming signal and transmission lines utilizing strip-line technology. Vias are formed to interconnect predetermined metallic layers.

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Glendale, AZ, United States of America

Thomas M Europa