Georgia Tech Research Corporation

Tcpoly Inc.

Thomas Lloyd Bougher

Baratunde A Cola

Virendra Singh

Matthew Kirby Smith

Kyriaki Kalaitzidou

John H Taphouse

Matthew Smith

Andrew Myers

Jacob Lloyd

A device for cutting a filament of a 3D printer includes a blade having a first end and a second end opposite the first end. The device also includes a support that is attachable to a heater block of the 3D printer and supports the blade, such that the blade is movable relative to the heater block. The first end of the blade is a cutting end, and the second end of the blade is a drive end. The drive end of the blade has a surface configured to receive a force from outside of the device, such that the blade moves relative to the heater block.

Device and method for cutting a continuous fiber 3D printing filament

A thermal management device includes a single contiguous component. The single contiguous component includes a first portion made of a first thermally conductive plastic, and a second portion extending away from the first portion. The second portion is made of a second thermally conductive plastic. The second thermally conductive plastic is different than the first thermally conductive plastic. The second portion has a greater hardness than the first portion.

Additive manufactured multi-layer thermally conductive parts

In order to provide a thermally conductive polymer-based resin that may be molded using a range of thermoplastic manufacturing techniques, a composition includes a thermoplastic polymer and/or elastomer, a polymer fiber, a binding agent, and a thermally conductive filler. The composition includes from 40 to 80 volume percentage of a thermoplastic polymer and/or a thermoplastic elastomer, from 5 to 30 volume percentage of a polymer fiber, from 0.1 to 20 volume percentage of a binding agent, and from 10 to 40 volume percentage of a thermally conductive filler. The polymer fibers and thermally conductive fillers are combined to create a hybrid thermally conductive particle for better feeding in standard plastic processing methods. The polymer fiber has an aspect ratio greater than 10. The filler has a thermal conductivity greater than or equal to 10 W/m-K. The composition is characterized by a thermal conductivity of at least 1 W/m-K.

Polymer-polymer fiber composite for high thermal conductivity

Carbon nanotube (CNT) forests or sheets coated and/or bonded at room temperature with one or more coatings were measured to produce thermal resistances that are on par with conventional metallic solders. These results were achieved by reducing the high contact resistance at CNT tips and/or sidewalls, which has encumbered the development of high-performance thermal interface materials based on CNTs. Resistances as low as 4.9&#xb1;0.3 mm-K/W were achieved for the entire polymer-coated CNT interface structure.

Methods for reducing thermal resistance of carbon nanotube arrays or sheets

Nano structured surfaces and bulk composite materials which exhibit tunable surface morphology, wettability, thermal conductivity, and total thermal resistance properties, and methods of fabrication and uses thereof are described herein. Arrays of vertically-aligned nanostructures produced via a template assisted fabrication approach using nanoporous templates, or alternatively, via an electropolymerization process are described. As a result, control over the surface morphology and wettability can be achieved using the selective template etching process. The composite materials also demonstrate tunable thermal and electrical properties based on the methods of their fabrication. The arrays of polymeric nanostructures are chemically, mechanically, and thermally robust and can serve as soft substrates with heat dissipation capability for use in the fabrication of thermal management materials, tunable wetting for microfluidic applications, and for use in heterojunction organic photovoltaic cells.

Polymer-based nanostructured materials with tunable properties and methods of making thereof

Carbon nanotube (CNT) forests or sheets coated and/or bonded at room temperature with one or more coatings were measured to produce thermal resistances that are on par with conventional metallic solders. These results were achieved by reducing the high contact resistance at CNT tips and/or sidewalls, which has encumbered the development of high-performance thermal interface materials based on CNTs. Resistances as low as 4.9&#xb1;0.3 mm&#x2212;K/W were achieved for the entire polymer-coated CNT interface structure.

Growing community of inventors

Atlanta, GA, United States of America

Thomas Lloyd Bougher