Infineon Technologies Ag

Wacker Polymer Systems Gmbh & Co. Kg

Thomas Lehmann

Jens G Pohl

Frank Pueschner

Horst Theuss

Abdulmajid Hashemzadeh

Mathias Vaupel

Klaus Kohlhammer

Thomas Spoettl

Peter Weiler

Roman Hollweck

A tank apparatus for an electronic inhaler, including a receptacle configured to hold a liquid to be vaporized, two supply lines configured to apply an electrical supply voltage to an electrical heater, and an authentication circuit configured to authenticate the tank apparatus. The authentication circuit has two supply terminals configured to apply an electrical supply voltage, and at least one of the supply lines is connectable to at least one of the supply terminals in an electrically conductive manner.

Tank apparatus for an electronic inhalation device, electronic inhalation device and method for authenticating a tank apparatus of an electronic inhalation device

Electrical contact

A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising:

Sensor arrangement

A semiconductor device includes a singulated semiconductor package having a leadframe, a chip electrically coupled to the leadframe, encapsulating material covering the chip and a portion of the leadframe, and a material layer disposed over opposing ends of the leadframe. The leadframe includes a first face and an opposing second face, the first and second faces extending between opposing ends of the leadframe, where the second face configured to electrically couple with a circuit board. The chip is electrically coupled to the first face. The encapsulating material covers the chip and the first face of the leadframe. The material layer is configured to improve solderability of the singulated semiconductor package to the circuit board.

Singulated semiconductor package

Particulate materials are cold molded by preheating a binder and the material to be bound to a temperature of from 160 to 240&deg; C., and then press molding at a temperature less than 80&deg; C. and at a pressure of from 1 to 120 bar to give a molding, wherein the binder contains a polymer powder or aqueous polymer dispersion thereof, the polymer having a glass transition temperature Tg greater than 80&deg; C. and a complex viscosity less than 15,000 Pa&middot;s at 190&deg; C., and derived from one or more comonomer units from the group of vinyl esters of optionally branched C alkylcarboxylic acids, (meth)acrylic esters of optionally branched C alcohols, dienes, olefins, vinylaromatics, and vinyl halides. The moldings exhibit excellent properties including resistance to sagging at elevated temperatures, and are recyclable.

Process for the cold molding of particulate materials

Growing community of inventors

Sinzing, Germany

Thomas Lehmann