Air Products and Chemicals, Inc.

Finisar Corporation

Thomas Lee Ellison

David A Roberts

John A Norman

John C Ivankovits

Robert H Shay

An optical sub-assembly includes a circuit and one or more electronic components electrically connected to the circuit. One of the electronic components is an optoelectronic device capable of transmitting or receiving light signals. Mounted to a surface of the optoelectronic device is an optical conduit. A first end of the optical conduit mounts to the optoelectronic device and a second end optionally cooperates with an optical component, such as a lens. The optical conduit channels light signals propagating toward or away from the optoelectronic device, while the optical component focuses or collimates such light signals. Securing the optical conduit relative to the optoelectronic device is a protective material such as a resin, epoxy, or other suitable material.

Integrated optical sub-assembly having epoxy chip package

Embodiments of the present invention disclose a transceiver module having a flexible circuit contained within a housing. The flexible circuit has various electronic components and either a photodiode or a laser transmitter disposed on and electrically connected to it. In alternate exemplary embodiments, both a photodiode and a laser are disposed on and connected to the flexible circuit. In addition, there can be electrical contacts disposed on and electrically connected to the flexible circuit. These electrical contacts can take the form of pads that are a standard form factor pluggable configuration, such as the Multisource Agreement Standard Form Factor Pluggable (MSA SFP) standard.

Optoelectronic module with components mounted on a flexible circuit

An optoelectronics packaging assembly is provided having a ceramic base on which is connected an optoelectronics device. The optoelectronic device is maintained in an enclosure formed by a housing, the base and/or other structures. The packaging assembly includes means for placing the base and the optoelectronics device in electrical communication with an external component, for example, a printed circuit board. The means include solder balls, J-shaped leads, bent leads, and electrical pads.

Optoelectronic packaging assembly

A residue-free fluxing process wherein the active fluxing agent comprises a .beta.-diketone or .beta.-ketoimine ligand. Such ligands react with surface metal oxides on workpieces to be soldered to form volatile metal-ligand complexes as reaction products which are sublimed from the surface leaving essentially no residue on the workpieces. The fluxing agents can be utilized in gas-phase processes wherein the workpieces are contacted with an effective amount of one or more ligands which are dispersed in a carrier gas or solvent or by incorporating the ligands into an alloy-vehicle mixture for use as conventional creams or pastes. The invention eliminates the need for post-reflow cleaning using solvents since no flux residue remains on the workpieces to be soldered following volitilization of the metal-ligand complex.

Fluxing agents comprising .beta.-diketone and .beta.-ketoimine ligands

A residue-free fluxing process wherein the active fluxing agent comprises a .beta.-diketone or .beta.-ketoimine ligand. Such ligands react with surface metal oxides on workpieces to be soldered to form volatile metal-ligand complexes as reaction products which are sublimed from the surface leaving essentially no residue on the workpieces. The fluxing agents can be utilized in gas-phase processes wherein the workpieces are contacted with an effective amount of one or more ligands which are dispersed in a carrier gas or solvent or by incorporating the ligands into an alloy-vehicle mixture for use as conventional creams or pastes. The invention eliminates the need for post-reflow cleaning using solvents since no flux residue remains on the workpieces to be soldered following volatilization of the metal-ligand complex.

A process for limiting the absorption of nitrogen by ferrous metal containing chromium as an alloying additive (e.g. stainless steel) during high temperature annealing in an atmosphere of nitrogen and hydrogen by controlled additions of an inhibitor selected from the group consisting of water vapor, oxygen, nitrous oxide, carbon dioxide or mixtures thereof to the atmosphere while controlling the dew point of the furnace atmosphere and/or the ratio of the partial pressure of the inhibitor to the partial pressure of the hydrogen.

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San Jose, CA, United States of America

Thomas Lee Ellison