Machine Technology, Inc.

Thomas L Strahl

Roderick Craig Mosely

Lawrence T Lamont, Jr

Hobart A Brown

Carl T Peterson

Lonnie W McCormick

Apparatus and method for the deposition of a thin metal film on a surface of a workpiece as the workpiece is positioned adjacent to a deposition source and as the workpiece and deposition source rotate relative to each other about a first axis. The workpiece can also be moved relative to the deposition source about a second axis as the workpiece and the deposition source rotate relative to each other about the first axis. The distance between the workpiece and the deposition source can be adjusted.

Thin film deposition apparatus and method

A method of processing a plurality of semiconductor wafers from a wafer cassette including a wafer transfer housing and one or more processing chambers. A wafer is removed from its cassette and transported through the transfer housing into one or more processing chambers for etching, deposition or other such operations. The processed wafer is replaced into its cassette after being transported back through the wafer transfer housing.

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Fremont, CA, United States of America

Thomas L Strahl