High Connection Density Inc.

Anaren Microwave, Inc.

High Connector Density, Inc.

Thomas L Sly

Che-Yu Li

Weimin Shi

Carl W Gerst, Iii

David A Lysack

Leonard J Paciorek

Dirk D Brown

The present invention features a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly thereto. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed-up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a motherboard or similar structure. A thermal control structure may be placed in the memory module, cooling the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.

High capacity memory module with high electrical design margins

The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology.

High density, high frequency memory chip modules having thermal management structures

There is a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly to the card. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a mother board or similar structure. A thermal control structure may be placed in the memory module to cool the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.

High capacity memory module with built-in-high-speed bus terminations

An angle digitizer receives signal representing the sine and cosine of the angle to be digitized. The voltages are fed to orthogonal pairs of input terminals. Between each two input terminals is a set of equivalued resistors to form a resistor ring. At the junction of each pair of resistors is an output terminal. Each pair of output terminals is connected to the input terminals of a signal amplitude comparator which compares the magnitude of the signals at its inputs to give a digital signal in accordance with which is greater. For each comparator the output terminals of the resistor ring are selected such that the signals are in a direct antiphase relationship. An odd set of the comparators is activated first followed by the activation of the even set. Thereafter the binary output values of the comparators are interleaved to form a full digital word which is then tested to see if it is a valid digital word.

Angle digitizing method

Signal modulation apparatus includes a PIN diode network which is fed a carrier signal from a carrier signal source and a modulation signal from modulating current output terminal which receives a modulation current directly from a temperature-compensated constant-current amplifier and a signal via a unity gain amplifier from a reference diode which is also fed from the constant-current amplifier which is adapted to receive a modulating signal.

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Cicero, NY, United States of America

Thomas L Sly