At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Dipl. Ing. Gottfried Steiner

Tac-fast Georgia L.l.c.

Tac-fast Systems Sa

Tac-fast Systems Canada Limited

Dipl. Ing. Gottfried Steiner, Ingenieurbuero Fuer Kunststofftechnik

Dipl. Ing. Gottfried Steiner, Ingenieurbüro Für Kunststofftechnik

Thomas Krivec

Joseph R Pacione

Jonathan Silvano De Sousa

Marco Gavagnin

Christian Vockenberger

Gernot Grober

Erich Schlaffer

Mike Morianz

Heinz Moitzi

Alexander Kasper

Wolfgang Schrittwieser

Erich Preiner

Gerald Weis

Gernot Schulz

Gottfried Steiner

Ferdinand Lutschounig

Franz Rittmannsberger

Jolanta Klocek

Markus Leitgeb

Rainer Frauwallner

Markus Frewein

Robert Sailer

Gernot Gmundner

Maike Sagerer

Julia Zuendel

Joseph Rocco Pacione

A method for determining an expansion coefficient of a test material comprises: receiving first image data of a compound material, wherein the compound material comprises a plate and a layer of the test material, which is attached to the plate; receiving second image data of the compound material, which has been exposed to an environmental condition, before the second image data has been recorded; determining a measured deformation of the compound material by comparing the first image data and the second image data; and performing a simulated deformation of a model of the compound material exposed to the environmental condition and determining the expansion coefficient of the test material by varying the expansion coefficient until the simulate deformation conforms to the measured deformation.

Expansion coefficient determination with deformation measurement and simulation

A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.

Laminated component carrier with a thermoplastic structure

A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Method for contacting and rewiring an electronic component embedded into a printed circuit board

A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.

Solder-free component carrier connection using an elastic element and method

A component carrier for carrying an electronic component on and/or in the component carrier, wherein the component carrier includes an interconnected stack composed of a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures, wherein at least part of at least one of the electrically conductive layer structures is configured as at least part of an integrated strain gauge configured for detecting strain exerted on at least part of the component carrier.

Component carrier with integrated strain gauge

An etching composition for etching an electrically conductive layer structure for forming a conductor track is provided. The etching composition includes an etchant, a highly branched compound and optionally a solvent. In addition, a method of etching an electrically conductive layer structure, a conductor track, an arrangement of at least two conductor tracks, and a component carrier are provided.

Anisotropic etching using highly branched polymers

An electric device which includes a first component carrier structure with a first magnet structure and a first connection structure, and a second component carrier structure with a second magnet structure and a second connection structure. The first magnet structure and the second magnet structure are configured such that upon attaching the first component carrier structure and the second component carrier structure to one another the first connection structure is connected to the second connection structure, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure.

Component carrier structures connected by cooperating magnet structures

A system and method for manufacturing a substrate having a bed of hooks located therein, in particular a system or manufacturing a hook plate having hooks with enlarged shaped heads. The system can include the use of a heated generally flat coining plate, a resilient layer placed under the hook plate, and a forming sheet placed between the coining plate and the tops of stems to be coined.

System and methods of manufacturing hook plates

A method and an injection mold for the production of profiled and at least partially elongated components out of liquid or viscous solidifying molding compounds, by said injection mold, the molding compound being injected into the mold cavity and transported away under steady extension of the mold cavity and under steady elongation of the component to be formed after the initial filling of the mold cavity. The molding compound transported away is transported out of the mold while molding compound is continuously being injected until the forming component reaches its final length. The mold has at least one mold insert whose surface is part of the peripheral surface of the mold cavity and which is supported in the mold in a movable way in longitudinal direction of the component to be formed so that the mold cavity forming the component can be expanded to the desired size and shape of the component inside and outside of the mold by a movement of the mold insert. Thus the invention makes it possible to produce components that have complex contours, are elongated, at least partially, and have a finite size in a high quality at a low expenditure.

Method and device for producing profiled, at least sectionally elongated elements

The invention relates to an injection molding installation with a fixed and a moveable machine clamping plate, and at least one injection unit as well as an injection molding device which is located between the machine clamping plates for producing profiled parts, elongated at least in sections, by means of closure-side components which are assigned to the one machine clamping plate, and nozzle-side components which are assigned to the other machine clamping plate, as well as a slide module which is located between these components and which has a slide which is arranged in a moveable manner on a closure-side or nozzle-side component, wherein said slide contributes to form an original mould cavity, and a drive module for controlling the movement of the moveable part(s) of the slide module, wherein the part is produced in the intended dimension and shape inside and outside the mold via the movement of the slide. An at least partial functional integration of at least the closure-side components, and/or the drive module, and or the slide module in one or more components in the installation is intended.

Injection-molding apparatus for producing profiled elongated parts

Growing community of inventors

Zeltweg, Austria

Thomas Krivec