Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Thomas Klose

Thilo Sandner

Harald Schenk

Christian Drabe

Alexander Wolter

Holger Conrad

Thomas Grasshoff

Denis Jung

Andreas Bergmann

Christian Gerwig

Thomas Knieling

Joerg Heber

Jörg Heber

Thomas Graβhoff

The invention relates to deflectable micromechanical elements which can preferably be deflected in translation and optionally also in an oscillatory manner. With respect to known solutions, it is the object of the invention to enable larger deflections with a simultaneously improved resistance toward lateral forces and torques. In this connection, a suspension having at least one spring system is present at elements in accordance with the invention. Levers pivotally connected to torsion spring elements are present at spring systems. Torsion spring elements of a spring system are aligned in a common axis and/or a plurality of axes arranged parallel to one another and at least one torsion spring element is fixedly clamped.

Micromechanical element which can be deflected

A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.

Micromechanical device with temperature stabilization and method for adjusting a defined temperature or a defined temperature course on a micromechanical device

The invention relates to the torsion springs for micromechanical applications. They can be used if elements are to be pivoted about an axis in an oscillating fashion. According to the object which is set, the torsion springs are to have an improved linear spring characteristic. The torsion springs according to the invention have a square, rectangular or trapezoidal cross section. A slot which is oriented orthogonally with respect to the longitudinal axis of the torsion spring and another slot which is formed in the torsion spring along its longitudinal axis and which opens into the first slot are formed at a clamping end point.

Torsion spring for micromechanical applications

A micromechanical element includes a movable functional element, a first retaining element, a second retaining element, a third retaining element, and a fourth retaining element. The first retaining element and the functional element are connected at a first junction, the second retaining element and the functional element are connected at a second junction, the third retaining element and the functional element are connected at a third junction, and the fourth retaining element and the functional element are connected at a fourth junction. In addition, the first retaining element and the second retaining element each include a piezoelectric driving element, the driving element of the first retaining element and the driving element of the second retaining element being configured to move the functional element in accordance with electric excitation.

Micromechanical element and sensor for monitoring a micromechanical element

Method for structuring a device layer of a substrate, wherein the substrate includes a carrier layer, the device layer and an intermediate layer disposed between the carrier layer and the device layer. Thereby, the intermediate layer is structured for exposing, at least in one portion, a first surface of the carrier layer facing the device layer. Starting from a second surface of the carrier layer opposing the first surface, the thickness of the device layer is reduced to a predetermined thickness at those positions where the intermediate layer is removed.

Method for structuring a device layer of a substrate

The invention relates to a method for the compensation of deviations occurring as a result of manufacture in the manufacture of micromechanical elements and their use which should be deflected at a resonant frequency. It is therefore the object of the invention to compensate deviations which occur due to manufacture and which have an influence on the resonant frequency of micromechanical elements in a simple and cost-effective manner. In accordance with the invention, a procedure is followed such that additional trenches and/or recesses are formed at the deflectable element simultaneously with the forming of the trenches by dry etching with which at least one spring element, a deflectable element and optionally also a frame element of micromechanical elements are formed. The trenches and recesses can thereby be formed under the same respective process parameters at the respective micromechanical element or at all micromechanical elements of a batch. A removal of material during etching, preferably dry etching, therefore takes place under the same etching conditions so that the respectively removed mass at trenches and/or recesses is influenced in the same manner by the etching process parameters.

Method for the compensation of deviations occurring as a result of manufacture in the manufacture of micromechanical elements and their use

In a method for manufacturing a micromechanical structure, first a two-dimensional structure is formed in a substrate. The two-dimensional structure is deflected from the substrate plane by action of force and fixed in the deflected state.

Method for generating a micromechanical structure

The invention relates to micromechanical elements deflectable in an oscillating manner and to a method for the operation of such elements. In this respect, it is the object of the invention to be able to operate the micromechanical elements in a stable and simple manner on the oscillating deflection while taking account of the respective mechanical resonant frequency. A least one spring element is present on elements in accordance with the invention with which it is held. It is deflected between two reversal points using an electrical AC voltage. The one or more spring element(s) has/have non-linear spring characteristics so that a changed mechanical resonant frequency results in dependence on the respective deflection.

Oscillating, deflectable micromechanical element and method for use thereof

The invention relates to deflectable micromechanical systems as well as their use in which the deflection of at least one deflectable element can be determined. In accordance with the invention, a deflectable element is held with at least one spring element and at least one unit detecting the deflection is present. It is formed as a piezoresistive sensor with contacts arranged at least at a spacing from one another and in a region deforming on deflection. The contacts are connected to an electrical voltage source. An inhomogeneous electrical field is formed perpendicular to the contact surfaces in the depth direction so that the electrical resistance between contacts varying in dependence on the deflection can be detected as a measure for the position. The deforming region is formed from electrically conductive or semiconductive material.

Deflectable micromechanical system and use thereof

A micromechanical device described has an oscillation system with an oscillation body and an elastic suspension, by which the oscillation body is oscillatorily suspended. The elastic suspension has at least two spring beams. An adjuster for adjusting a resonant frequency of the oscillation system by changing the position of the at least two spring beams of the elastic suspension towards each other is provided.

Micromechanical device with adjustable resonant frequency by geometry alteration and method for operating same

A micromechanical device has a layer; at least a first slot formed in the layer to define a first oscillation element oscillatably suspended via a first spring portion of the layer; and at least a second slot formed in the layer to define a second oscillation element oscillatably suspended via a second spring portion of the layer, wherein a trench is formed in the spring portion pair in a main surface of the layer, wherein a resonance frequency of the first oscillation element is different from that of the second oscillation element, and the first and second spring portions and the trench are formed such that, in an anisotropic lateral material removal and/or addition of the first and second spring portions, a ratio of a relative change of the resonance frequency of the second oscillation element to that of the first oscillation element ranges from 0.8 to 1.2.

Micromechanical device, micromechanical system, apparatus for adjusting sensitivity of a micromechanical device, method for producing a micromechanical device

A micromechanical device includes a micromechanical functional structure, which can be deflected about a main axis from a rest position, a movable electrode, which is mounted to the micromechanical functional structure, and a fixed electrode, which can be tilted about a tilting axis with respect to the movable electrode in the rest position, wherein the tilting axis is parallel to the main axis or is identical with the main axis.

Micromechanical device with tilted electrodes

By way of example, it would also be possible to dispense in a manner which is not illustrated with the spring elements, and then for the elementto carry out an oscillating translational deflection. Micromechanical optical elements have a reflective surface which can be deflected electrostatically or electromagnetically in a known manner and which can be used for a large number of applications. The objective is to provide an element such as this at low cost and with improved dynamic deformation behaviour. The elements with a reflective surface are in this case held by spring elements, in which case the element which can be deflected is held on mutually opposite sides by in each case at least two mutually independent spring elements.

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Dresden, Germany

Thomas Klose