Infineon Technologies Ag

Finisar Corporation

Thomas Killer

Juergen Hoegerl

Volker Strutz

Erich Syri

Gerold Gruendler

Hans-Ludwig Althaus

Josef Wittl

Gottfried Beer

Volker Plickert

Lutz Melchior

Hans Hurt

Martin Weigert

Frank Weberpals

Alfred Hartl

Melanie Ring

Hermann Josef Lutz

A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Semiconductor component with surface mountable devices and method for producing the same

A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.

Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape

A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.

Semiconductor device

A semiconductor device for an ultra-wideband standard for ultra-high-frequency communication includes an ultra-wideband semiconductor chip and a multilayer circuit substrate with at least one lower metal layer and one upper metal layer, in which an ultra-wideband circuit with passive devices is arranged. The lower metal layer has external contact pads on which external contacts are arranged, via which the semiconductor device can be surface-mounted on a circuit board. In addition, the semiconductor device has an antenna which is operatively coupled to the ultra-wideband semiconductor chip via the circuit on the circuit substrate and is arranged above the semiconductor chip and the circuit substrate.

Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same

A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

Semiconductor module including semiconductor chips in a plastic housing in separate regions

A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary, which is arranged on the surface and at least partly surrounds the subregion of the surface. A method is also disclosed for arranging a semiconductor device on the surface of a support element, with the steps of: providing a support element which has at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, introducing an adhesive fluid within the fluid-tight boundary, and introducing a semiconductor device into the adhesive fluid.

Semiconductor device support element with fluid-tight boundary

A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.

Heat sink for surface-mounted semiconductor devices and mounting method

The invention relates to an optoelectronic transmission and/or reception arrangement. The arrangement includes a transmission and/or reception module containing an optoelectronic transmission and/or reception component, and a plug interface for the coupling of an optical fiber thereto. An optical waveguide section is arranged in the plug interface, and at one of its ends is optically coupled to the transmission and/or reception component. At its other end, the optical waveguide section is configured to be coupled to an optical fiber. The arrangement may further include a lens for optical coupling of the light between the optical waveguide section and the transmission and/or reception component. The lens and the optical waveguide section, in one example, are formed as a prefabricated subassembly, in which the lens is fixedly arranged at a defined distance from one end face of the optical waveguide section.

Optoelectronic transmission and/or reception arrangement

An optoelectronic transmission and/or reception arrangement with an optical unit having a transmission component and/or a reception component, an electrical circuitry component for the transmission component and/or the reception component, a circuit carrier, on which the components are mounted and contact-connected, and a coupling part for receiving and coupling at least one optical fiber which can be optically coupled to the transmission component and/or the reception component. The electrical contact-connection of the circuit carrier is effected via the coupling part.

Optoelectronic transmission and/or reception arrangements having a surface-mounted optoelectronic component and a circuit board provided with electrical lines, the optoelectronic component being surface-mounted on said circuit board, the optical axis of the optoelectronic component running perpendicular to the plane of the circuit board. In one embodiment, provision is made of a holding apparatus for receiving and orienting an optical waveguide to be coupled to the optoelectronic component, which holding apparatus directly adjoins the side of the optoelectronic component that is remote from the circuit board. In another embodiment, the circuit board has a cutout and light is coupled into or out of the optoelectronic component in the direction of the cutout of the circuit board.

Optoelectronic transmission and/or reception arrangements

An optoelectronic component with an optoelectronic transducer device and an electrical circuit electrically connected to the transducer device mounted on a carrier substrate which is optically transparent for specific wavelengths. The transducer device is arranged on the front side of the carrier substrate, and light coupling takes place through the back side. The electrical circuit is formed as a circuit integrated into the carrier substrate or is formed on the carrier substrate using hybrid technology, the terminal contacts of the circuit being arranged on the front side of the carrier substrate. An optoelectronic arrangement with an optoelectronic component includes an at least partly planar-formed mounting element, which is connected by its one side to an outer side of the component or is integrated in the latter and extends at least as far as an outer edge of the component, and includes a mechanical interface for the mechanical connection of the component.

Optoelectronic component and optoelectronic arrangement with an optoelectronic component

The invention relates to a metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components. According to the invention, the metal carrier has at least two regions of different thickness. This opens up the possibility of fitting even relatively thick electrical or optoelectronic components on a leadframe with a predetermined overall structural height.

Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components

The invention relates to a module having a circuit carrier and having an electro-optical transducer mounted thereon for coupling in or out optical beams which are fed or conducted away via an optical fiber. The electro-optical transducer has an optical waveguide holder mounted onto a circuit carrier, the end side of which optical waveguide holder has an optoelectronic component having an optically active region, the optically active region being oriented to an optical waveguide receptacle of an optical waveguide holder.

Growing community of inventors

Hohenschambach, Germany

Thomas Killer