Infineon Technologies Ag

Thomas Kalin

Edward Fuergut

Carsten Von Koblinski

Holger Woerner

Alfred Binder

Martin Matschitsch

Kurt Aigner

Ingomar Maunz

A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.

Semiconductor structure with a plastic housing and separable carrier plate

A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

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Treffen, Austria

Thomas Kalin