Regibus Max Microelectronics LLC

Interposers Gmbh

Swiss Technology Enterprise Gmbh

Thomas Kaiser

Andreas Jakob

In a method for producing a semi-conductor module () comprising at least two semi-conductor chips () and an interposer () which has electrically conductive structures () connecting the semi-conductor chips () to one another, the interposer () is printed directly onto a first () of the semi-conductor chips. When the interposer () is printed on, the electrically conductive structures () are produced by means of electrically conductive ink (). The second semi-conductor chip () is mounted on the interposer () such that the two semi-conductor chips () are arranged one above the other and that the interposer () forms an intermediate layer between the two semi-conductor chips ().

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Munich, Germany

Thomas Kaiser