Robert Boschgmbh

Thomas Kaden

Manfred Reinold

Denis Gugel

Paeivi Lehtonen

Thomas Suenner

Immanuel Mueller

Tim Behrens

Dirk Brinkmann

An electronic assembly includes a leadframe (), a semiconductor component (), and an electrically conductive connecting element () made of a composite material (). The connecting element () has a solderable metallization () on the composite material () on a surface that is directed towards the semiconductor component (). A thermal conductivity of the composite material () of the connecting element () is greater than a thermal conductivity of the semiconductor component () and less than a thermal conductivity of the leadframe (). The connecting element () is provided only locally in the region of the semiconductor component ().

Electronic assembly with improved thermal management

A bond between two contact surfaces using at least two bonding wires, as well as a method for producing such a bond. The bonding wires are positioned one above the other and are conductively interconnected.

Bond and method for bonding two contact surfaces

A tool head for attaching an electrical conductor on the contact surface of a substrate, comprising a vibration exciter for generating linear ultrasonic vibrations; a bonding tool that is able to contact the contact surface and/or the conductor, a contact pressure being able to be applied to the conductor in the direction of the contact point via the bonding tool, and the conductor is able to be welded onto the contact point with the aid of the ultrasonic vibrations able to be transmitted to the contact point and/or the conductor in this manner; and a vibration conductor absorbing the linear ultrasonic vibrations of the vibration exciter; a converter being provided between the vibration conductor and the bonding tool to convert the linear vibrations into radial vibrations in such a way that the bonding tool is able to be incited to rotary vibrations.

Tool head for attaching an electrical conductor on the contact surface of a substrate and method for implementing the attachment

Growing community of inventors

Schwieberdingen, Germany

Thomas Kaden