Big Bear Networks, Inc.

Thomas J Sleboda

Hui Wu

Yu Ju Chen

Michael Zhong Xuan Wong

An integrated high-speed package comprising a package housing having a housing lip and connector having a center pin abutting along a bottom surface of the housing lip. For signal registration of a first substrate to the signal lead, the substrate is &ldquo;floated&rdquo; up to the housing lip, which provides an alignment reference to ensure that the top surface of the first substrate is aligned and in direct registration with the signal lead. In another embodiment, the center pin to substrate registration is provided at a top surface of a housing base. The housing base preferably comprises a first portion of a first height and a second portion of a second height. Accordingly, the housing base can accommodate substrates of different thickness while allowing a top surface of the first and a second substrate to be coplanar to facilitate signal registration there between.

Growing community of inventors

Milpitas, CA, United States of America

Thomas J Sleboda