Deere + Company

Clark Equipment Compnay

Alliance for Sustainable Energy, LLC

Thomas J Roan

Brij N Singh

Larry E Albright

Andrew Dean Wieland

Kevin Scott Bennion

Dan A Frederick

Rodney Koch

Gilberto Moreno

Michael J Zurn

Brad G Palmer

Robert K Kinyanjui

Neal D Clements

Gary W Weddle

James E Asche

Gary J Homola

Maria C Homola, Legal Representative

Emily Cousineau

Christopher J Schmit

David Michael Loken

Lance S Tuhy

Erich Joel Drees

Nicole L Fuss, Legal Representative

Karla J Frederick, Legal Representative

Jeff K Hansen

Gregory L Fischer

Andrew J Wieland

Travis Mackey

Lance Kistner

Travis J Mackey

Lance T Kistner

Andrew D Wieland

Andrew Wieland

Erich J Drees

Singh N Brij

Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.

Condensers and electronic assemblies

Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Evaporator stacks and electronic assemblies

A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly once, a first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer; and second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Method for manufacturing an electronic assembly

The first wall has a first inbound cavity for receiving a coolant from an inlet port. The first wall has a first outbound cavity for directing the coolant from the inbound cavity to the input of the transition passage. The second wall has a second inbound cavity for receiving a coolant from the output of the transition passage. The second wall has a second outbound cavity for directing the coolant from the inbound cavity to the outlet port. The transition passage comprises a transverse hollow volume for interconnecting the first outbound cavity of the first wall to the second inbound cavity of a second wall. At least one heat-generating component (e.g., inductor) in the interior of the housing generates heat that is dissipated.

Electrical assembly having cavities for coolant

In accordance with one aspect of the disclosure, an electronic assembly comprises a semiconductor device with a first side and a second side opposite the first side. The first side has a first conductive pad. The second side has a primary metallic surface. A first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer. A second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Electronic assembly with enhanced thermal dissipation

An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening. The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.

Electronic assembly with enhanced high power density

An electronic assembly comprises a heat-generating semiconductor device that has a first side and a second side opposite the first side. An evaporator stack has a floor and a hollow body. The evaporator stack overlies the first side of the semiconductor device. The heated floor can convert a liquid-phase of a coolant (e.g., refrigerant) into a gas-phase of the coolant. A condensation container is in communication with the evaporator stack and is arranged to receive a gas-phase of the coolant. The condensation container is configured to convert the received gas-phase of the coolant into a liquid phase to replenish the liquid-phase coolant for interaction with the floor of the evaporator stack.

Electronic assembly with phase-change cooling of a semiconductor device

An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. Magnetic field concentrators are spaced apart to concentrate a magnetic field in a zone. The magnetic field is associated with electric current carried by the electrical connector assembly. A flexible circuit carrier has openings to receive the magnetic field concentrators. The flexible circuit carrier comprises a flexible dielectric layer and a conductive traces. A magnetic field sensor is mounted on the flexible circuit carrier in the zone.

Electrical connector assembly

An electrical assembly comprises a dielectric substrate and a metallic conductive trace overlying the substrate. The metallic conductive trace has a hollow cross-section that forms a duct. An annular member protrudes from the metallic conductive trace. The annular member has an opening in communication with the duct, the opening for receiving pressurized air or gas.

Cooling conductive trace with pressurized air or gas

An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. The first interface surface may include a plurality of elongated first ridges and a plurality of elongated first valleys, and the second interface surface may include a plurality of elongated second ridges and a plurality of elongated second valleys. A first ridge is received by a second valley and a second ridge is received by a first valley.

An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Electronic assembly with one or more heat sinks

A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric shell or shell is adapted to at least radially contain or border the first winding member and the second winding member. The first winding member is electrically connected to a first conductive end. A second winding member is electrically connected to a second conductive end. The second conductive end is opposite the first conductive end. The first conductive end forms a first lead; the second conductive end forms a second lead.

Film capacitor having a package for heat transfer

A conduit connector assembly for attachments on a loader includes a mounting plate with at least one coupler section mounted on the plate and secured rigidly to a forward end of one of the lift arms of a loader. The coupler section or sections are connected with conduits to power or electrical signal sources on the loader. The coupler section or sections on the lift arm are connectable to mating coupler sections attached to conduits from an attachment that requires power and/or control signals for operation. The coupler sections are supported to one side of the lines of vision that an operator in an operator's cab of the loader needs for watching the attachment.

Growing community of inventors

Augusta, GA, United States of America

Thomas J Roan