Samsung Electronics Co., Ltd.

The Directv Group, Inc.

Interconnect Portfolio LLC

Silicon Pipe, Inc.

Thomas J Obenhuber

Joseph Charles Fjelstad

Para Kanagasabai Segaram

Kevin P Grundy

Inessa Obenhuber, Legal Representative

William F Wiedemann

Craig Owens

Steven L Herrick

Gary Yasumura

Para K Segaram

David B Donahue

Benn Bollay

Vinai Kolli

An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

Multi-surface IC packaging structures

An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.

Cabled signaling system and components thereof

Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.

Low profile discrete electronic components and applications of same

Multi-surface IC packaging structures and methods for their manufacture

A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.

Multi-surface contact IC packaging structures and assemblies

A method for remotely communicating with a Broadband modem is provided. Once a communication error is detected on a Broadband modem, a Plain Old Telephone System (POTS) connection is established between the Broadband modem and a remote server. Communication then occurs with the remote server via the POTS connection using Dual-Tone Multi-Frequency (DTMF) tones. The communication preferably comprises transmitting information associated with the communication error to the remote server via the POTS connection using DTMF tones and receiving a diagnosis from the remote server via the POTS connection in DTMF tones. A system for remotely diagnosing a Broadband modem as well as a Broadband modem is also provided.

System and method for remotely communicating with a Broadband modem

System and method for remotely communicating with a broadband modem

A method for communicating across divergent network segments in a network. The network has a first network segment and a second network segment. The first network segment includes a switch that is controlled by a module that has instructions encoding a method. In the method, an ARP request packet is received from a first device. The ARP request packet includes a request to locate a second device. The first device is coupled to the first network segment and the second device is coupled to the second network segment. The ARP request packet is broadcast to the network segments outside of the first network segment and, as a result, a reply from the second network segment is received. The reply is transmitted to the first device, such that in use, ARP tables are modified on the first device and the second device so that future communication between said first device and said second device is enabled using a layer two communication protocol without any requirement for a layer three communication protocol.

Method and apparatus for communicating between divergent networks using media access control communications

A device module may be used to carry a plurality of devices, such as memory devices or other components. The device module may include a board, a first set of contact points, and a second set of contact points. A plurality of signal paths may be provided on the board, where each signal path extends between a contact point in the first set and a contact point in the second set. Each of the plurality of signal paths has substantially an identical length and a same number of turns on the board.

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San Francisco, CA, United States of America

Thomas J Obenhuber